Atomic Layer Deposition of WO 3 -Doped In 2 O 3 for Reliable and Scalable BEOL-Compatible Transistors

Tungsten oxide (WO ) doped indium oxide (IWO) field-effect transistors (FET), synthesized using atomic layer deposition (ALD) for three-dimensional integration and back-end-of-line (BEOL) compatibility, are demonstrated. Low-concentration (1∼4 W atom %) WO -doping in In O films is achieved by adjust...

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Veröffentlicht in:Nano letters 2024-05, Vol.24 (19), p.5737-5745
Hauptverfasser: Yoo, Chanyoung, Hartanto, Jonathan, Saini, Balreen, Tsai, Wilman, Thampy, Vivek, Niavol, Somayeh Saadat, Meng, Andrew C, McIntyre, Paul C
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container_end_page 5745
container_issue 19
container_start_page 5737
container_title Nano letters
container_volume 24
creator Yoo, Chanyoung
Hartanto, Jonathan
Saini, Balreen
Tsai, Wilman
Thampy, Vivek
Niavol, Somayeh Saadat
Meng, Andrew C
McIntyre, Paul C
description Tungsten oxide (WO ) doped indium oxide (IWO) field-effect transistors (FET), synthesized using atomic layer deposition (ALD) for three-dimensional integration and back-end-of-line (BEOL) compatibility, are demonstrated. Low-concentration (1∼4 W atom %) WO -doping in In O films is achieved by adjusting cycle ratios of the indium and tungsten precursors with the oxidant coreactant. Such doping suppresses oxygen deficiency from In O to In O stoichiometry with only 1 atom % W, allowing devices to turn off stably and enhancing threshold voltage stability. The ALD IWO FETs exhibit superior performance, including a low subthreshold slope of 67 mV/decade and negligible hysteresis. Strong tunability of the threshold voltage ( ) is achieved through W concentration tuning, with 2 atom % IWO FETs showing an optimized for enhancement-mode and a high drain current. ALD IWO FETs have remarkable stability under bias stress and nearly ideal performance extending to sub-100 nm channel lengths, making them promising candidates for high-performance monolithic 3D integrated devices.
doi_str_mv 10.1021/acs.nanolett.4c00746
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