Atomistic Insights into Cu Chemical Mechanical Polishing Mechanism in Aqueous Hydrogen Peroxide and Glycine: ReaxFF Reactive Molecular Dynamics Simulations

To clarify the chemical mechanical polishing (CMP) mechanism of Cu in aqueous hydrogen peroxide and glycine, we developed a ReaxFF reactive force field to describe the interaction between Cu, slurry (H2O, H2O2, and glycine), and the silica abrasive. Based on this force field, we used molecular dynam...

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Veröffentlicht in:	Journal of physical chemistry. C 2019-10, Vol.123 (43), p.26467-26474
Hauptverfasser:	Wen, Jialin, Ma, Tianbao, Zhang, Weiwei, van Duin, Adri C. T, van Duin, Diana M, Hu, Yuanzhong, Lu, Xinchun
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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