Establishment and assessment of a variable-area parameterized model of microchannel for high temperature uniformity

•Designed a novel inner-fin microchannel (IFMC) heat dissipation structure.•Established a parameterized model between structure parameters and heating condition.•Standard deviation of temperature (SDT) decrease rate of over 96.05%.•Meeting both uniform and non-uniform heat dissipation conditions of device. Maintaining temperature uniformity of the device is a crucial factor in reducing the risk of local overheating and ensuring high performance stability. In this paper, we proposed a novel inner-fin microchannel (IFMC) cooling system based on the ideas of variable density microstructures and local densification design principles, and further established a parameterized model between the inner-fin height and heating condition for improving the temperature uniformity. The numerical simulation studies indicated the IFMC heat sink can maintain a high temperature uniformity under uniform and non-uniform heat flux densities. The maximum temperature different on heating surface (ΔT) of the IFMC heat sink is less than 2.6 K when the inlet velocity varies between 0.8 m/s and 1.4 m/s under uniform heat flux density. The ΔT with one hotspot and two hotspot areas is 2.03 K and 1.75 K when the heat flux densities of the hotspot and background area on the heating surface are 300 W/cm2 and 150 W/cm2, respectively. Moreover, the standard deviation of temperature (SDT) on the heating surface of the IFMC structure is much lower than that of the traditional microchannel (TMC) structure at the same inlet flow rate, with a decrease rate of over 96.05 %. These studies can provide reference for further design and development of equipment cooling systems with high temperature uniformity.