Wafer direct bonding with ambient pressure plasma activation

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Bibliographische Detailangaben
Veröffentlicht in:	Microsystem technologies : sensors, actuators, systems integration actuators, systems integration, 2006-04, Vol.12 (5), p.397-400
Hauptverfasser:	GABRIEL, Markus, JOHNSON, Brad, SUSS, Ralf, REICHE, Manfred, EICHLER, Marko
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Electronics Exact sciences and technology Instruments, apparatus, components and techniques common to several branches of physics and astronomy Mechanical engineering. Machine design Mechanical instruments, equipment and techniques Microelectronic fabrication (materials and surfaces technology) Micromechanical devices and systems Physics Precision engineering, watch making Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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