Investigation on the equipment and tool influencing factors on machining performance of endless diamond wire sawing

At present, solar energy is the key development of clean energy. Diamond wire sawing (DWS) is the most used processing method of solar crystalline silicon cell wafer. In recent years, the application of crystalline silicon cutting that can be applied by single wire has gradually turned to that of EDWS. However, the research on the equipment and process requirements of endless diamond wire is limited, and the mastery of the equipment factors affecting the performance of EDWS is not perfect. This paper takes the influence of some constituent factors of EDWS equipment on processing performance as the research object; focuses on the analysis of the wire length, wire brand, guide wheel diameter, cutting wheel span, driving wheel position, and wheel number of the EDWS system; and finds out the deep causes and correlation of the influencing factors. It provides a basis for giving full play to the performance of endless wire sawing from the equipment composition.