Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

The presence of an intermetallic is often an indication of good wetting in a solder joint. However, excessive intermetallic growth and the brittleness of the intermetallic layer may be detrimental to joint reliability. This study examined the growth and mechanical behavior of interfacial intermetall...

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Veröffentlicht in:	Metallurgical and materials transactions. A, Physical metallurgy and materials science Physical metallurgy and materials science, 1994-07, Vol.25 (7), p.1509-1523
Hauptverfasser:	FREAR, D. R, VIANCO, P. T
Format:	Artikel
Sprache:	eng
Schlagworte:	360102 - Metals & Alloys- Structure & Phase Studies 360103 - Metals & Alloys- Mechanical Properties ALLOYS ANTIMONY ALLOYS Applied sciences Brazing. Soldering COPPER CRYSTAL GROWTH ELECTRONIC EQUIPMENT ELEMENTS Exact sciences and technology FABRICATION FILLER METALS FRACTURE PROPERTIES INDIUM ALLOYS INTERFACES INTERMETALLIC COMPOUNDS JOINING Joining, thermal cutting: metallurgical aspects JOINTS LEAD ALLOYS MATERIALS SCIENCE MECHANICAL PROPERTIES METALS Metals. Metallurgy RELIABILITY SILVER ALLOYS SOLDERED JOINTS SOLDERING TIN ALLOYS TRANSITION ELEMENTS WELDING
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