Recent advances in photosensitive polyimides
The state of the art of photosensitive polyimides is reviewed with respect to the incorporation of photosensitivity into both polyimide precursors and soluble polyimides, for patterning in positive and negative modes. This paper emphasizes, in particular, the discussion of the performance of commerc...
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| Veröffentlicht in: | Polymers for advanced technologies 1993-05, Vol.4 (4), p.217-233 |
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| container_title | Polymers for advanced technologies |
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| creator | Ahne, Hellmut Leuschner, Rainer Rubner, Roland |
| description | The state of the art of photosensitive polyimides is reviewed with respect to the incorporation of photosensitivity into both polyimide precursors and soluble polyimides, for patterning in positive and negative modes. This paper emphasizes, in particular, the discussion of the performance of commercially available photosensitive polyimides with respect to their applications in electronics. The decisive properties, especially the patterning performance, and in the case of precursors the curing conditions, required to obtain full imidization, thermomechanical and electrical properties, solvent resistance and water uptake, as well as planarization of the commercially available materials, are compared with each other. An outlook presents the future demands on photosensitive polyimides. |
| doi_str_mv | 10.1002/pat.1993.220040402 |
| format | Article |
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Adv. Technol</addtitle><date>1993-05</date><risdate>1993</risdate><volume>4</volume><issue>4</issue><spage>217</spage><epage>233</epage><pages>217-233</pages><issn>1042-7147</issn><eissn>1099-1581</eissn><abstract>The state of the art of photosensitive polyimides is reviewed with respect to the incorporation of photosensitivity into both polyimide precursors and soluble polyimides, for patterning in positive and negative modes. This paper emphasizes, in particular, the discussion of the performance of commercially available photosensitive polyimides with respect to their applications in electronics. The decisive properties, especially the patterning performance, and in the case of precursors the curing conditions, required to obtain full imidization, thermomechanical and electrical properties, solvent resistance and water uptake, as well as planarization of the commercially available materials, are compared with each other. An outlook presents the future demands on photosensitive polyimides.</abstract><cop>Chichester, UK</cop><pub>John Wiley & Sons, Ltd</pub><doi>10.1002/pat.1993.220040402</doi><tpages>17</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 1042-7147 |
| ispartof | Polymers for advanced technologies, 1993-05, Vol.4 (4), p.217-233 |
| issn | 1042-7147 1099-1581 |
| language | eng |
| recordid | cdi_crossref_primary_10_1002_pat_1993_220040402 |
| source | Access via Wiley Online Library |
| subjects | Photosensitive Polyimide Precursors Properties Review |
| title | Recent advances in photosensitive polyimides |
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