Laser Beam Activation of CNT‐Filled Polymer Blends: Shortening of the process chain in the laser‐direct structuring

3D‐Molded Interconnect Devices enable the placement of electronic circuits on three‐dimensional plastic components. The following article breaks new ground in order to add reasonably to existing 3D‐MID procedures. An essential aspect was the shortening of the process chain of the conventional MID procedures through laser‐direct structuring. Thus the metallising steps are no longer necessary and a 3D circuit carrier structure can be created directly on any plastic component. The research work focused on the space‐resolved modification of the electric conductivity of non‐conductive plastic components through a newly‐developed procedure of laser beam functionalisation. The principle is based on the application of multi‐phase polymer blends with matrix‐disperse phase structures in which carbon nanotubes are located. They cross‐link on the component surface through a partial laser activation and create a conductive area.