Interfacial Reaction Boosts Thermal Conductance of Room‐Temperature Integrated Semiconductor Interfaces Stable up to 1100 °C

Overheating has emerged as a primary challenge constraining the reliability and performance of next‐generation high‐performance (ultra)wide bandgap (WBG or UWBG) electronics. Advanced heterogeneous bonding of high‐thermal‐conductivity WBG thin films and substrates not only constitutes a pivotal tech...

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Veröffentlicht in:	Advanced electronic materials 2024-10
Hauptverfasser:	Ji, Xiaoyang, Huang, Zifeng, Ohno, Yutaka, Inoue, Koji, Nagai, Yasusyohi, Sakaida, Yoshiki, Uratani, Hiroki, Sun, Jinchi, Shigekawa, Naoteru, Liang, Jianbo, Cheng, Zhe
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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