High Thermal Conductivity 2D Materials: From Theory and Engineering to Applications (Adv. Mater. Interfaces 21/2022)
High Thermal Conductivity 2D Materials In article number 2200409, Fan Wu, He Tian, Chao‐yang Xing, Gang Zhang, Tian‐Ling Ren, and co‐workers discuss high thermal conductivity 2D materials from theory and engineering to applications, especially on graphene and hexagonal boron nitride. The impact fact...
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| Veröffentlicht in: | Advanced materials interfaces 2022-07, Vol.9 (21), p.n/a |
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| container_title | Advanced materials interfaces |
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| creator | Wu, Fan Tian, He Shen, Yang Zhu, Zheng‐Qiang Liu, Yanming Hirtz, Thomas Wu, Rui Gou, Guangyang Qiao, Yancong Yang, Yi Xing, Chao‐Yang Zhang, Gang Ren, Tian‐Ling |
| description | High Thermal Conductivity 2D Materials
In article number 2200409, Fan Wu, He Tian, Chao‐yang Xing, Gang Zhang, Tian‐Ling Ren, and co‐workers discuss high thermal conductivity 2D materials from theory and engineering to applications, especially on graphene and hexagonal boron nitride. The impact factors and development path of 2D materials for thermal dissipation and the engineering aspect of structural design are presented. Moreover, the future opportunities to build 2D‐based heat‐dissipation systems are discussed. |
| doi_str_mv | 10.1002/admi.202270116 |
| format | Article |
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In article number 2200409, Fan Wu, He Tian, Chao‐yang Xing, Gang Zhang, Tian‐Ling Ren, and co‐workers discuss high thermal conductivity 2D materials from theory and engineering to applications, especially on graphene and hexagonal boron nitride. The impact factors and development path of 2D materials for thermal dissipation and the engineering aspect of structural design are presented. Moreover, the future opportunities to build 2D‐based heat‐dissipation systems are discussed.</description><subject>2D materials</subject><subject>graphene</subject><subject>heat spreaders</subject><subject>hexagonal boron nitride</subject><subject>thermal conductivity</subject><subject>thermal dissipation</subject><subject>thermal interface materials</subject><issn>2196-7350</issn><issn>2196-7350</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2022</creationdate><recordtype>article</recordtype><recordid>eNqFkM1Lw0AQxRdRsNRePe9RD0lnd9NN4i201hZavNRz2O5Hu5Jsym6s5L83oaLehIE3MO_3GB5C9wRiAkCnQtU2pkBpCoTwKzSiJOdRymZw_We_RZMQ3gF6DyU0YyPUruzhiHdH7WtR4Xnj1Ids7dm2HaYLvBWt9lZU4QkvfVMPvsZ3WDiFn93BOt1f3QG3DS5Op8pK0drGBfxQqHN8gWO8dr0YIXXAlEyHFx_v0I3pQ_XkW8fobfm8m6-izevLel5sIknShEcS8kRywVNDWa60ZLA3SaY0yMykklMNipBkJmiW51TLWUr2GWNJwo3aD8PGKL7kSt-E4LUpT97WwnclgXKorRxqK39q64H8AnzaSnf_uMtisV3_sl9VxXBY</recordid><startdate>20220721</startdate><enddate>20220721</enddate><creator>Wu, Fan</creator><creator>Tian, He</creator><creator>Shen, Yang</creator><creator>Zhu, Zheng‐Qiang</creator><creator>Liu, Yanming</creator><creator>Hirtz, Thomas</creator><creator>Wu, Rui</creator><creator>Gou, Guangyang</creator><creator>Qiao, Yancong</creator><creator>Yang, Yi</creator><creator>Xing, Chao‐Yang</creator><creator>Zhang, Gang</creator><creator>Ren, Tian‐Ling</creator><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>20220721</creationdate><title>High Thermal Conductivity 2D Materials: From Theory and Engineering to Applications (Adv. Mater. Interfaces 21/2022)</title><author>Wu, Fan ; Tian, He ; Shen, Yang ; Zhu, Zheng‐Qiang ; Liu, Yanming ; Hirtz, Thomas ; Wu, Rui ; Gou, Guangyang ; Qiao, Yancong ; Yang, Yi ; Xing, Chao‐Yang ; Zhang, Gang ; Ren, Tian‐Ling</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c1746-c094c6a67f239dec30bf48de0c8f7c62e0d1145a28992ec571b833446fdbfdbf3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2022</creationdate><topic>2D materials</topic><topic>graphene</topic><topic>heat spreaders</topic><topic>hexagonal boron nitride</topic><topic>thermal conductivity</topic><topic>thermal dissipation</topic><topic>thermal interface materials</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Wu, Fan</creatorcontrib><creatorcontrib>Tian, He</creatorcontrib><creatorcontrib>Shen, Yang</creatorcontrib><creatorcontrib>Zhu, Zheng‐Qiang</creatorcontrib><creatorcontrib>Liu, Yanming</creatorcontrib><creatorcontrib>Hirtz, Thomas</creatorcontrib><creatorcontrib>Wu, Rui</creatorcontrib><creatorcontrib>Gou, Guangyang</creatorcontrib><creatorcontrib>Qiao, Yancong</creatorcontrib><creatorcontrib>Yang, Yi</creatorcontrib><creatorcontrib>Xing, Chao‐Yang</creatorcontrib><creatorcontrib>Zhang, Gang</creatorcontrib><creatorcontrib>Ren, Tian‐Ling</creatorcontrib><collection>CrossRef</collection><jtitle>Advanced materials interfaces</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Wu, Fan</au><au>Tian, He</au><au>Shen, Yang</au><au>Zhu, Zheng‐Qiang</au><au>Liu, Yanming</au><au>Hirtz, Thomas</au><au>Wu, Rui</au><au>Gou, Guangyang</au><au>Qiao, Yancong</au><au>Yang, Yi</au><au>Xing, Chao‐Yang</au><au>Zhang, Gang</au><au>Ren, Tian‐Ling</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>High Thermal Conductivity 2D Materials: From Theory and Engineering to Applications (Adv. Mater. Interfaces 21/2022)</atitle><jtitle>Advanced materials interfaces</jtitle><date>2022-07-21</date><risdate>2022</risdate><volume>9</volume><issue>21</issue><epage>n/a</epage><issn>2196-7350</issn><eissn>2196-7350</eissn><abstract>High Thermal Conductivity 2D Materials
In article number 2200409, Fan Wu, He Tian, Chao‐yang Xing, Gang Zhang, Tian‐Ling Ren, and co‐workers discuss high thermal conductivity 2D materials from theory and engineering to applications, especially on graphene and hexagonal boron nitride. The impact factors and development path of 2D materials for thermal dissipation and the engineering aspect of structural design are presented. Moreover, the future opportunities to build 2D‐based heat‐dissipation systems are discussed.</abstract><doi>10.1002/admi.202270116</doi><tpages>1</tpages><oa>free_for_read</oa></addata></record> |
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| source | Wiley Online Library Journals Frontfile Complete |
| subjects | 2D materials graphene heat spreaders hexagonal boron nitride thermal conductivity thermal dissipation thermal interface materials |
| title | High Thermal Conductivity 2D Materials: From Theory and Engineering to Applications (Adv. Mater. Interfaces 21/2022) |
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