The formation of silicon carbide films from disilane derivatives
The formation of silicon carbide films presents problems arising from the fact that the precursors employed are usually a mixture of compounds. It is demonstrated that high‐quality silicon carbide films (see Figure) can be produced by chemical vapor deposition using easily available disilane derivat...
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Veröffentlicht in: | Advanced materials (Weinheim) 1994-07, Vol.6 (7-8), p.584-587 |
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creator | Hengge, Edwin Zechmann, Arno Hofer, Ferdinand Pölt, Peter Lux, Benno Danzinger, Michael Haubner, Roland |
description | The formation of silicon carbide films presents problems arising from the fact that the precursors employed are usually a mixture of compounds. It is demonstrated that high‐quality silicon carbide films (see Figure) can be produced by chemical vapor deposition using easily available disilane derivatives as the precursor. |
doi_str_mv | 10.1002/adma.19940060713 |
format | Article |
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It is demonstrated that high‐quality silicon carbide films (see Figure) can be produced by chemical vapor deposition using easily available disilane derivatives as the precursor.</description><identifier>ISSN: 0935-9648</identifier><identifier>EISSN: 1521-4095</identifier><identifier>DOI: 10.1002/adma.19940060713</identifier><language>eng</language><publisher>Weinheim: WILEY-VCH Verlag GmbH</publisher><subject>Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.) ; Cross-disciplinary physics: materials science; rheology ; Exact sciences and technology ; Materials science ; Methods of deposition of films and coatings; film growth and epitaxy ; Physics</subject><ispartof>Advanced materials (Weinheim), 1994-07, Vol.6 (7-8), p.584-587</ispartof><rights>Copyright © 1994 Verlag GmbH & Co. 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It is demonstrated that high‐quality silicon carbide films (see Figure) can be produced by chemical vapor deposition using easily available disilane derivatives as the precursor.</description><subject>Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.)</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Exact sciences and technology</subject><subject>Materials science</subject><subject>Methods of deposition of films and coatings; film growth and epitaxy</subject><subject>Physics</subject><issn>0935-9648</issn><issn>1521-4095</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1994</creationdate><recordtype>article</recordtype><recordid>eNqFkEFLAzEUhIMoWKt3j3vwuvqyL9k0B8FStQpVsVQKXkJ2k2B0t1uSUu2_d8tK0ZOnNzDzzYMh5JTCOQXILrSp9TmVkgHkICjukR7lGU0ZSL5PeiCRpzJng0NyFOM7AMgc8h65mr3ZxDWh1ivfLJLGJdFXvmxlqUPhTWv6qo6JC02dGN-aemETY4Nft8TaxmNy4HQV7cnP7ZOX25vZ6C6dPI3vR8NJWmKeYYrOuEIyZ6hF60AaUWDGmSmQMyaB5WJQaCFLZJpTDoW2YtDmtHQWZYYM-wS63jI0MQbr1DL4WoeNoqC2C6jtAurXAi1y1iFLHUtduaAXpY87DpFJClkbu-xin76ym39r1fD6Yfj3TdrxPq7s147X4UPlAgVX88exeubTCZ2_SjXFbybrfOE</recordid><startdate>199407</startdate><enddate>199407</enddate><creator>Hengge, Edwin</creator><creator>Zechmann, Arno</creator><creator>Hofer, Ferdinand</creator><creator>Pölt, Peter</creator><creator>Lux, Benno</creator><creator>Danzinger, Michael</creator><creator>Haubner, Roland</creator><general>WILEY-VCH Verlag GmbH</general><general>WILEY‐VCH Verlag GmbH</general><general>Wiley</general><scope>BSCLL</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>199407</creationdate><title>The formation of silicon carbide films from disilane derivatives</title><author>Hengge, Edwin ; Zechmann, Arno ; Hofer, Ferdinand ; Pölt, Peter ; Lux, Benno ; Danzinger, Michael ; Haubner, Roland</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c3623-3fdfb94fd1e3ef09d7b3254db3544904678ba79c34a5150bae78ef0a9fe392343</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1994</creationdate><topic>Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.)</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Exact sciences and technology</topic><topic>Materials science</topic><topic>Methods of deposition of films and coatings; film growth and epitaxy</topic><topic>Physics</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Hengge, Edwin</creatorcontrib><creatorcontrib>Zechmann, Arno</creatorcontrib><creatorcontrib>Hofer, Ferdinand</creatorcontrib><creatorcontrib>Pölt, Peter</creatorcontrib><creatorcontrib>Lux, Benno</creatorcontrib><creatorcontrib>Danzinger, Michael</creatorcontrib><creatorcontrib>Haubner, Roland</creatorcontrib><collection>Istex</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><jtitle>Advanced materials (Weinheim)</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Hengge, Edwin</au><au>Zechmann, Arno</au><au>Hofer, Ferdinand</au><au>Pölt, Peter</au><au>Lux, Benno</au><au>Danzinger, Michael</au><au>Haubner, Roland</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The formation of silicon carbide films from disilane derivatives</atitle><jtitle>Advanced materials (Weinheim)</jtitle><addtitle>Adv. 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subjects | Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.) Cross-disciplinary physics: materials science rheology Exact sciences and technology Materials science Methods of deposition of films and coatings film growth and epitaxy Physics |
title | The formation of silicon carbide films from disilane derivatives |
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