A State‐of‐the‐Art Review of Through‐Silicon Vias : Filling Materials, Filling Processes, Performance, and Integration

Through‐silicon via (TSV) technology realizes high‐density interconnections within and between different dies (chips) by vertically drilling holes in silicon and filling them with various conductive materials. It is an effective way to achieve miniaturization, lightweight, and multi‐functionality in...

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Veröffentlicht in:	Advanced engineering materials 2024-12
Hauptverfasser:	Xia, Qianfu, Zhang, Xinrui, Ma, Binghe, Tao, Kai, Zhang, Hemin, Yuan, Weizheng, Ramakrishna, Seeram, Ye, Tao
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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