Non-destructive wafer-level bond defect identification by scanning acoustic microscopy

Metal-based thermocompression bonding enables the creation of hermetic seals formed at relatively low processing temperatures and occupying a small portion of the device area. In the current study we have investigated the application of scanning acoustic microscopy (SAM) for assessing the quality of...

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Hauptverfasser:	Brand, Sebastian, Tismer, Sebastian, Moe, Sigurd T, Schjølberg-Henriksen, Kari
Format:	Artikel
Sprache:	eng
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