Texture of Al films for wafer-level thermocompression bonding

Properties of aluminum thin films for thermocompression bonding have been studied in terms of surface roughness, grain size, and grain orientation by AFM, SEM, XRD and EBSD for thermocompression bonding. Al films were sputter deposited directly on Si and thermally oxidized Si wafers, respectively. T...

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Hauptverfasser:	Malik, Nishant, Venkatachalapathy, Vishnukanthan, Dall, Wilhelm, Schjølberg-Henriksen, Kari, Poppe, Erik Utne, Taklo, Maaike M. Visser, Finstad, Terje
Format:	Artikel
Sprache:	eng
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