Influence of filler morphology on percolation threshold of isotropical conductive adhesives （ICA）

Different aspect ratio silver nano-structured materials including nanocubes, nanorods and nanowires were prepared by microwaved assisted glycol reduction method. Different characterization methods including SEM and XRD were processed on these nanomaterials. Isotropical conductive adhesives （ICA） were developed by using these Ag nanomaterials as conductive fillers. It was found that the conductivity and thermal conductivity percolation threshold of the ICA depended on the morphologies of the fillers, lower percolation threshold could be obtained by using higher aspect ratio filler. A modified percolation threshold theory was put forward to explain and simulate the experiment results, the simulated results could match the experiment results very well.