Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Siow, Kim S
Format:	Buch
Sprache:	eng
Schlagworte:	Characterization and Evaluation of Materials Chemistry and Materials Science Electronics and Microelectronics, Instrumentation Materials Engineering Materials Science Metallic Materials Microelectronic packaging Optical and Electronic Materials Quality Control, Reliability, Safety and Risk
Online-Zugang:	Volltext
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