RF and Microwave Microelectronics Packaging II

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to RF and Microwave Microelectronics Packaging (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and pro...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kuang, Ken, Sturdivant, Rick
Format:	Buch
Sprache:	eng
Schlagworte:	Circuits and Systems Electronics and Microelectronics, Instrumentation Engineering Microwaves, RF and Optical Engineering Systems engineering
Online-Zugang:	Volltext
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