A multi-channel silicon package for large-scale skipper-CCD experiments
The next generation of experiments for rare-event searches based on skipper Charge Coupled Devices (skipper-CCDs) presents new challenges for the sensor packaging and readout. Scaling the active mass and simultaneously reducing the experimental backgrounds in orders of magnitude requires a novel hig...
Gespeichert in:
| Hauptverfasser: | , , , , , , , , , , , , |
|---|---|
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Botti, A. M Chavez, C Sofo-Haro, M Miller, C. S Chierchie, F Jonas, M Lisovenko, M Gutti, H Czaplewski, D Lathrop, A Tiffenberg, J Fernandez-Moroni, G Estrada, J |
| description | The next generation of experiments for rare-event searches based on skipper
Charge Coupled Devices (skipper-CCDs) presents new challenges for the sensor
packaging and readout. Scaling the active mass and simultaneously reducing the
experimental backgrounds in orders of magnitude requires a novel high-density
silicon-based package that must be massively produced and tested. In this work,
we present the design, fabrication, testing, and empirical signal model of a
multi-channel silicon package. In addition, we outline the chosen
specifications for the ongoing production of 1500 wafers that will add up to a
10 kg skipper-CCD array with 24000 readout channels. |
| doi_str_mv | 10.48550/arxiv.2410.06417 |
| format | Article |
| fullrecord | <record><control><sourceid>arxiv_GOX</sourceid><recordid>TN_cdi_arxiv_primary_2410_06417</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2410_06417</sourcerecordid><originalsourceid>FETCH-arxiv_primary_2410_064173</originalsourceid><addsrcrecordid>eNpjYJA0NNAzsTA1NdBPLKrILNMzMgEKGJiZGJpzMrg7KuSW5pRk6iZnJOblpeYoFGfmZCbn5ykUJCZnJ6anKqTlFynkJBalp-oWJyfmpCoUZ2cWFKQW6To7uyikVgBZmbmpeSXFPAysaYk5xam8UJqbQd7NNcTZQxdsZXwBUFliUWU8yOp4sNXGhFUAAIfnOQU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>A multi-channel silicon package for large-scale skipper-CCD experiments</title><source>arXiv.org</source><creator>Botti, A. M ; Chavez, C ; Sofo-Haro, M ; Miller, C. S ; Chierchie, F ; Jonas, M ; Lisovenko, M ; Gutti, H ; Czaplewski, D ; Lathrop, A ; Tiffenberg, J ; Fernandez-Moroni, G ; Estrada, J</creator><creatorcontrib>Botti, A. M ; Chavez, C ; Sofo-Haro, M ; Miller, C. S ; Chierchie, F ; Jonas, M ; Lisovenko, M ; Gutti, H ; Czaplewski, D ; Lathrop, A ; Tiffenberg, J ; Fernandez-Moroni, G ; Estrada, J</creatorcontrib><description>The next generation of experiments for rare-event searches based on skipper
Charge Coupled Devices (skipper-CCDs) presents new challenges for the sensor
packaging and readout. Scaling the active mass and simultaneously reducing the
experimental backgrounds in orders of magnitude requires a novel high-density
silicon-based package that must be massively produced and tested. In this work,
we present the design, fabrication, testing, and empirical signal model of a
multi-channel silicon package. In addition, we outline the chosen
specifications for the ongoing production of 1500 wafers that will add up to a
10 kg skipper-CCD array with 24000 readout channels.</description><identifier>DOI: 10.48550/arxiv.2410.06417</identifier><language>eng</language><subject>Physics - Instrumentation and Detectors ; Physics - Instrumentation and Methods for Astrophysics</subject><creationdate>2024-10</creationdate><rights>http://creativecommons.org/licenses/by/4.0</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>228,230,776,881</link.rule.ids><linktorsrc>$$Uhttps://arxiv.org/abs/2410.06417$$EView_record_in_Cornell_University$$FView_record_in_$$GCornell_University$$Hfree_for_read</linktorsrc><backlink>$$Uhttps://doi.org/10.48550/arXiv.2410.06417$$DView paper in arXiv$$Hfree_for_read</backlink><backlink>$$Uhttps://doi.org/10.1109/JSEN.2025.3529769$$DView published paper (Access to full text may be restricted)$$Hfree_for_read</backlink></links><search><creatorcontrib>Botti, A. M</creatorcontrib><creatorcontrib>Chavez, C</creatorcontrib><creatorcontrib>Sofo-Haro, M</creatorcontrib><creatorcontrib>Miller, C. S</creatorcontrib><creatorcontrib>Chierchie, F</creatorcontrib><creatorcontrib>Jonas, M</creatorcontrib><creatorcontrib>Lisovenko, M</creatorcontrib><creatorcontrib>Gutti, H</creatorcontrib><creatorcontrib>Czaplewski, D</creatorcontrib><creatorcontrib>Lathrop, A</creatorcontrib><creatorcontrib>Tiffenberg, J</creatorcontrib><creatorcontrib>Fernandez-Moroni, G</creatorcontrib><creatorcontrib>Estrada, J</creatorcontrib><title>A multi-channel silicon package for large-scale skipper-CCD experiments</title><description>The next generation of experiments for rare-event searches based on skipper
Charge Coupled Devices (skipper-CCDs) presents new challenges for the sensor
packaging and readout. Scaling the active mass and simultaneously reducing the
experimental backgrounds in orders of magnitude requires a novel high-density
silicon-based package that must be massively produced and tested. In this work,
we present the design, fabrication, testing, and empirical signal model of a
multi-channel silicon package. In addition, we outline the chosen
specifications for the ongoing production of 1500 wafers that will add up to a
10 kg skipper-CCD array with 24000 readout channels.</description><subject>Physics - Instrumentation and Detectors</subject><subject>Physics - Instrumentation and Methods for Astrophysics</subject><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2024</creationdate><recordtype>article</recordtype><sourceid>GOX</sourceid><recordid>eNpjYJA0NNAzsTA1NdBPLKrILNMzMgEKGJiZGJpzMrg7KuSW5pRk6iZnJOblpeYoFGfmZCbn5ykUJCZnJ6anKqTlFynkJBalp-oWJyfmpCoUZ2cWFKQW6To7uyikVgBZmbmpeSXFPAysaYk5xam8UJqbQd7NNcTZQxdsZXwBUFliUWU8yOp4sNXGhFUAAIfnOQU</recordid><startdate>20241008</startdate><enddate>20241008</enddate><creator>Botti, A. M</creator><creator>Chavez, C</creator><creator>Sofo-Haro, M</creator><creator>Miller, C. S</creator><creator>Chierchie, F</creator><creator>Jonas, M</creator><creator>Lisovenko, M</creator><creator>Gutti, H</creator><creator>Czaplewski, D</creator><creator>Lathrop, A</creator><creator>Tiffenberg, J</creator><creator>Fernandez-Moroni, G</creator><creator>Estrada, J</creator><scope>GOX</scope></search><sort><creationdate>20241008</creationdate><title>A multi-channel silicon package for large-scale skipper-CCD experiments</title><author>Botti, A. M ; Chavez, C ; Sofo-Haro, M ; Miller, C. S ; Chierchie, F ; Jonas, M ; Lisovenko, M ; Gutti, H ; Czaplewski, D ; Lathrop, A ; Tiffenberg, J ; Fernandez-Moroni, G ; Estrada, J</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-arxiv_primary_2410_064173</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2024</creationdate><topic>Physics - Instrumentation and Detectors</topic><topic>Physics - Instrumentation and Methods for Astrophysics</topic><toplevel>online_resources</toplevel><creatorcontrib>Botti, A. M</creatorcontrib><creatorcontrib>Chavez, C</creatorcontrib><creatorcontrib>Sofo-Haro, M</creatorcontrib><creatorcontrib>Miller, C. S</creatorcontrib><creatorcontrib>Chierchie, F</creatorcontrib><creatorcontrib>Jonas, M</creatorcontrib><creatorcontrib>Lisovenko, M</creatorcontrib><creatorcontrib>Gutti, H</creatorcontrib><creatorcontrib>Czaplewski, D</creatorcontrib><creatorcontrib>Lathrop, A</creatorcontrib><creatorcontrib>Tiffenberg, J</creatorcontrib><creatorcontrib>Fernandez-Moroni, G</creatorcontrib><creatorcontrib>Estrada, J</creatorcontrib><collection>arXiv.org</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Botti, A. M</au><au>Chavez, C</au><au>Sofo-Haro, M</au><au>Miller, C. S</au><au>Chierchie, F</au><au>Jonas, M</au><au>Lisovenko, M</au><au>Gutti, H</au><au>Czaplewski, D</au><au>Lathrop, A</au><au>Tiffenberg, J</au><au>Fernandez-Moroni, G</au><au>Estrada, J</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A multi-channel silicon package for large-scale skipper-CCD experiments</atitle><date>2024-10-08</date><risdate>2024</risdate><abstract>The next generation of experiments for rare-event searches based on skipper
Charge Coupled Devices (skipper-CCDs) presents new challenges for the sensor
packaging and readout. Scaling the active mass and simultaneously reducing the
experimental backgrounds in orders of magnitude requires a novel high-density
silicon-based package that must be massively produced and tested. In this work,
we present the design, fabrication, testing, and empirical signal model of a
multi-channel silicon package. In addition, we outline the chosen
specifications for the ongoing production of 1500 wafers that will add up to a
10 kg skipper-CCD array with 24000 readout channels.</abstract><doi>10.48550/arxiv.2410.06417</doi><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | DOI: 10.48550/arxiv.2410.06417 |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_arxiv_primary_2410_06417 |
| source | arXiv.org |
| subjects | Physics - Instrumentation and Detectors Physics - Instrumentation and Methods for Astrophysics |
| title | A multi-channel silicon package for large-scale skipper-CCD experiments |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-06T19%3A08%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-arxiv_GOX&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=A%20multi-channel%20silicon%20package%20for%20large-scale%20skipper-CCD%20experiments&rft.au=Botti,%20A.%20M&rft.date=2024-10-08&rft_id=info:doi/10.48550/arxiv.2410.06417&rft_dat=%3Carxiv_GOX%3E2410_06417%3C/arxiv_GOX%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |