Electro-mechanical studies of micro-tube insertion into Al–Cu pads for 10μm pitch interconnection technology and 3D applications von Goubault de Brugière, B., Marion, F., Fendler, M., Mandrillon, V., Hazotte, A., Volpert, M., Ribot, H.

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A cm-scale, low wind velocity and 250°C-compliant airflow-driven harvester for aeronautic applications von Gasnier, P, Willemin, J, Boisseau, S, Goubault De Brugière, B, Pillonnet, G, Gomez, B, Neyret, I

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A 10μm pitch interconnection technology using micro tube insertion into Al-Cu for 3D applications von de Brugiere, B. G., Marion, F., Fendler, M., Mandrillon, V., Hazotte, A., Volpert, M., Ribot, H.

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Micro tube insertion into indium, copper and other materials for 3D applications von de Brugière, B Goubault, Marion, F, Fendler, M, Mandrillon, V, Hazotte, A, Volpert, M, Ribot, H

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Aluminum to Aluminum bonding at room temperature von Marion, F., de Brugiere, B. Goubault, Bedoin, A., Volpert, M., Berger, F., Gueugnot, A., Anciant, R., Ribot, H.

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Reuse Method for Quantum Circuit Synthesis von Allouche, C., Baboulin, M., Goubault de Brugière, T., Valiron, B.

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