On the initial stages and growth process of intermetallic compounds at Cu/Sn interface: A MD simulation and experimental study von Zu, Zichong, Chen, Dongdong, Zhang, Xin, Bai, Hailong, Leng, Chongyan, Gan, Guoyou, Yan, Jikang

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Comparison of Ignition Process and Thermodynamic Conditions of TC4 and TC17 Alloys Under High-Speed Rubbing Ignition von Li, Yajun, Li, Jianjun, Zu, Zichong, Wang, Congzhen, Zhang, Yuqi, Shao, Lei, Huang, Jinfeng

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Method for preparing nanoscale welding flux additive through chemical reaction von LONG ZAN, XU FENGXIAN, YAN JIKANG, ZU ZICHONG, CHEN DONGDONG, YI JIANHONG

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Method for preparing Ag3Sn solder nano additive through chemical reaction method von LU HONGBO, LONG ZAN, BAI HAILONG, QIN JUNHU, LIANG DONGCHENG, YAN JIKANG, ZU ZICHONG, CHEN DONGDONG, ZHAO LINGYAN, YI JIANHONG

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Sn-Bi-Cu-Ag-Ni-Sb low temperature lead-free solder alloy with high mechanical property von LONG ZAN, XU FENGXIAN, GAN GUOYOU, LIANG DONGCHENG, YAN JIKANG, ZU ZICHONG, LIU MING, CHEN DONGDONG, TENG YUAN, GU XIN, YI JIANHONG, CHEN JUNYU

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