Hierarchical MoO2/N-doped carbon heteronanowires with high rate and improved long-term performance for lithium-ion batteries von Yang, L.C., Sun, W., Zhong, Z.W., Liu, J.W., Gao, Q.S., Hu, R.Z., Zhu, M.

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LCAs of a polycrystalline photovoltaic module and a wind turbine von Zhong, Z.W., Song, B., Loh, P.E.

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Measurement of the surface roughness of wood based materials used in furniture manufacture von Zhong, Z.W., Hiziroglu, Salim, Chan, C.T.M.

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Evolutionary in Solid State Recycling Techniques of Aluminium: A review von Shamsudin, Shazarel, Lajis, MA, Zhong, Z.W.

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Evaluation of fan-out wafer level package strength von Xu, Cheng, Zhong, Z.W, Choi, W.K

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A study of meniscus formation and its effect on roll-to-roll UV embossing von Zhong, Z.W., Shan, X.C.

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Weld strength in solid–state recycling of aluminum chips: Schweißnahtfestigkeit im Festkörper‐Recycling von Aluminium‐Spänen von Shamsudin, S., Lajis, M.A., Zhong, Z.W., Ahmad, A., Wagiman, A.

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Stability of single-walled carbon nanotubes and single-walled carbon nanocones under self-weight and an axial tip force von Mustapha, K.B., Zhong, Z.W.

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Wire bonding using copper wire von Zhong, Z.W

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Ductile or Partial Ductile Mode Machining of Brittle Materials von Zhong, Z.W.

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Factorial Experiment on Route Structures Using SAAM on a Specified Area in ASEAN von Phyoe, S.M., Goh, J.W., Guo, R., Zhong, Z.W.

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Study of factors affecting the hardness of ball bonds in copper wire bonding von Zhong, Z.W., Ho, H.M., Tan, Y.C., Tan, W.C., Goh, H.M., Toh, B.H., Tan, J.

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Wire bonding using insulated wire and new challenges in wire bonding von Zhong, Z.W

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Fine and ultra-fine pitch wire bonding: challenges and solutions von Zhong, Z.W

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Wire bonding of low-k devices von Zhong, Z.W

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A microgripper using piezoelectric actuation for micro-object manipulation von Nah, S.K., Zhong, Z.W.

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Parametric investigation of flexographic printing processes for R2R printed electronics von Zhong, Z. W., Ee, J. H., Chen, S. H., Shan, X. C.

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Recent advances in wire bonding, flip chip and lead-free solder for advanced microelectronics packaging von Zhong, Z.W, Tee, T.Y, Luan, J-E

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Control, navigation and collision avoidance for an unmanned aerial vehicle von Chee, K.Y., Zhong, Z.W.

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Towards a QFD-based expert system: A novel extension to fuzzy QFD methodology using rough set theory von Zhai, L.Y., Khoo, L.P., Zhong, Z.W.

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