Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review von Li, Mu-lan, Zhang, Liang, Jiang, Nan, Zhang, Lei, Zhong, Su-juan

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Development of lead-free interconnection materials in electronic industry during the past decades: Structure and properties von Zhong, Su-juan, Zhang, Liang, Li, Mu-lan, Long, Wei-min, Wang, Feng-jiang

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Review of microstructure and properties of low temperature lead-free solder in electronic packaging von Xu, Kai-Kai, Zhang, Liang, Gao, Li-Li, Jiang, Nan, Zhang, Lei, Zhong, Su-Juan

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Influences of silicon carbide nanowires’ addition on IMC growth behavior of pure Sn solder during solid–liquid diffusion von Li, Mu-lan, Zhang, Liang, Jiang, Nan, Zhong, Su-juan, Zhang, Lei

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Properties and microstructure evolution of Sn–Cu–Ni/Cu joints bearing carbon nanotubes and graphene nanosheets for solar cell von Zhang, Liang, Jiang, Nan, He, Peng, Zhong, Su-Juan

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Effect of nano-Al addition on properties and microstructure of low-Ag content Sn–1Ag–0.5Cu solders von Sun, Lei, Zhang, Liang, Xu, Le, Zhong, Su-Juan, Ma, Jia, Bao, Li

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Influence of copper nanowires on properties and microstructure of low-Ag Sn-1Ag-0.5Cu solders von Li, Zhi-Hao, Zhang, Liang, Gao, Li-Li, Long, Wei-Min, Zhong, Su-Juan, Zhang, Lei

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Influence of doping Ti particles on intermetallic compounds growth at Sn58Bi/Cu interface during solid–liquid diffusion von Jiang, Nan, Zhang, Liang, Long, Wei-min, Zhong, Su-juan, Zhang, Lei

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Effect of Ni3Sn4 on the Thermo-Mechanical Fatigue Life of Solder Joints in 3D IC von Zhang, Liang, Zhong, Su-Juan

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Interfacial reaction and properties of Sn/Cu solder reinforced with graphene nanosheets during solid–liquid diffusion and reflowing von Li, Mu-lan, Gao, Li-li, Zhang, Liang, Jiang, Nan, Zhong, Su-juan, Zhang, Lei

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Microstructure evolution of Cu/Sn58Bi/Cu solder joint bearing graphene nanosheets for 3D packaging von Jiang, Nan, Zhang, Liang, Gao, Li-li, Long, Wei-min, Zhong, Su-juan, Zhang, Lei

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Interfacial evolution of pure Sn solder bearing silicon carbide nanowires under isothermal aging and thermal cycling von Li, Mu-lan, Gao, Li-li, Zhang, Liang, Long, Wei-min, Zhong, Su-juan, Zhang, Lei

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Properties and Microstructures of Sn-Bi-X Lead-Free Solders von Ma, Jia, Zhong, Su-juan, Liu, Zhi-quan, Zhang, Liang, Yang, Fan, Bao, Li

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Study on diamond vacuum brazed with Cu-based filler metal containing Cr von Lu, Jin-bin, Li, Hua, Li, Yang, Gong, Zheng, Zhong, Su-juan, Qiu, Xin-kai

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Properties and microstructure of Sn–0.7Cu–0.05Ni lead-free solders with rare earth Nd addition von Liu, Shuang, Xue, Song-bai, Zhong, Su-juan, Pei, Ying-ying, Sun, Hua-wei

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Cu₆Sn₅ Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer von Zhang, Liang, Liu, Zhi-Quan, Yang, Fan, Zhong, Su-Juan

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Deformation treatment and microstructure of graphene-reinforced metal matrix nanocomposites: A review of graphene post-dispersion von Mei, Yong, Shao, Pu-zhen, Sun, Ming, Chen, Guo-qin, Hussain, Murid, Huang, Feng-lei, Zhang, Qiang, Gao, Xiao-sa, Pei, Yin-yin, Zhong, Su-juan, Wu, Gao-hui

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Whisker growth on SnAgCu–xPr solders in electronic packaging von Zhang, Liang, Yang, Fan, Zhong, Su-juan

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Reliability study of industry Sn3.0Ag0.5Cu/Cu lead-free soldered joints in electronic packaging von Sun, Lei, Zhang, Liang, Zhong, Su-juan, Ma, Jia, Bao, Li

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Effect of Nd on whiskers growth behavior of SnAgCu solders in electronic packaging von Zhang, Liang, Yang, Fan, Zhong, Su-juan

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