3-D Integration and Through-Silicon Vias in MEMS and Microsensors von Wang, Zheyao

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Motion Measurement Using Inertial Sensors, Ultrasonic Sensors, and Magnetometers With Extended Kalman Filter for Data Fusion von Zhao, He, Wang, Zheyao

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Fabrication of ternary Ge-Se-Sb chalcogenide microlens arrays using thermal reflow von Xiong, Hao, Wang, Zheyao

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Microsystems using three-dimensional integration and TSV technologies: Fundamentals and applications von Wang, Zheyao

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A MEMS-Based Electric Field Sensor for Measurement of High-Voltage DC Synthetic Fields in Air von Ma, Qing, Huang, Kaitian, Yu, Zhanqing, Wang, Zheyao

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Highly Sensitive Surface-Enhanced Raman Scattering Substrate Made from Superaligned Carbon Nanotubes von Sun, Yinghui, Liu, Kai, Miao, Jiao, Wang, Zheyao, Tian, Baozhong, Zhang, Lina, Li, Qunqing, Fan, Shoushan, Jiang, Kaili

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Research on a Novel MEMS Sensor for Spatial DC Electric Field Measurements in an Ion Flows Field von Mou, Ya, Yu, Zhanqing, Huang, Kaitian, Ma, Qing, Zeng, Rong, Wang, Zheyao

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Steady flow of pressure-driven water-in-oil droplets in closed-open-closed microchannels von Wang, Linjue, Niu, Chenqi, Zhang, Chong, Wang, Zheyao

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Silicon Diode Uncooled FPA With Three-Dimensional Integrated CMOS Readout Circuits von Xue, Xingjun, Xiong, Hao, Song, Zhen, Du, Yuxin, Wu, Dong, Pan, Liyang, Wang, Zheyao

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Air-Gap Through-Silicon Vias von Huang, Cui, Chen, Qianwen, Wang, Zheyao

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High-Frequency Characterization of Through-Silicon-Vias With Benzocyclobutene Liners von Wu, Ke, Wang, Zheyao

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Low-Capacitance Through-Silicon-Vias With Combined Air/SiO2 Liners von Huang, Cui, Wu, Ke, Wang, Zheyao

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Ultralow-Capacitance Through-Silicon Vias With Annular Air-Gap Insulation Layers von Chen, Qianwen, Huang, Cui, Wu, Dong, Tan, Zhimin, Wang, Zheyao

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Low Capacitance Through-Silicon-Vias With Uniform Benzocyclobutene Insulation Layers von Chen, Qianwen, Huang, Cui, Tan, Zhimin, Wang, Zheyao

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Benzocyclobutene polymer filling of high aspect-ratio annular trenches for fabrication of Through-Silicon-Vias (TSVs) von Chen, Qianwen, Huang, Cui, Wang, Zheyao

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High aspect ratio and low capacitance through-silicon-vias (TSVs) with polymer insulation layers von Huang, Cui, Chen, Qianwen, Wu, Dong, Wang, Zheyao

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Data Compression for Image Sensor Arrays Using a 15-bit Two-Step Sigma-Delta ADC von Yue, Mengyun, Wu, Dong, Wang, Zheyao

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Design and Numerical Verification of a Gate-Controlled Lateral Thyristor for Low-Light Level Detection von Sun, Keyang, Pan, Liyang, Wu, Dong, Xu, Jun, Wang, Zheyao

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3-D Integration of MEMS and CMOS Using Electroless Plated Nickel Through-MEMS-Vias von Du, Yuxin, Wu, Dong, Song, Zhen, Liu, Miao, Yang, Sujie, Wang, Zheyao

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Heat-Depolymerizable Polypropylene Carbonate as a Temporary Bonding Adhesive for Fabrication of Flexible Silicon Sensor Chips von Xue, Xingjun, Yang, Shujie, Wang, Zheyao

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