Bionic flutter wing piezoelectric-electromagnetic composite energy harvesting system von Bo, Fan, Jiwen, Fang, Jiuchun, Zhao, Chong, Li, Jia, Wang, Mingming, Lv

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Fuzzy sliding mode control of piezo-driven stage von Fang, Jiwen, Zhao, Jiuchun, Zhang, Lufan, Li, Chong, Zhong, Wei, Zhang, Lianren

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A piezoelectric energy harvester based on multi-cantilevers and magnetic force von Wang, Jia, Fan, Bo, Fang, Jiwen, Zhao, Jiuchun, Li, Chong

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Special personal security wire for overhead ground wire von MOU XIN, SHAN GUOJIAN, TONG ALUMUSI, WU YANMING, ZHAO JIUCHUN, CUI BO

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Aircraft with ejection communication relay station von WANG JIA, LYU MINGMING, LI CHONG, ZHAO JIUCHUN, FANG JIWEN

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Ultrasonic-assisted soldering of SiC ceramic and aluminum alloy with a commercial inactive Sn3.0Ag0.5Cu solder von Zhao, Di, Zhao, Chenchen, Xiu, Ziyang, Yan, Jiuchun

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Leveraging Multi-Level Semantic Understanding in a Unified NER Model von Zhao, Yuqian, Ren, Jiuchun

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Ultrasonic cavitation at liquid/solid interface in a thin Ga–In liquid layer with free surface von Li, Zhengwei, Xu, Zhiwu, Zhao, Degang, Chen, Shu, Yan, Jiuchun

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An optimal internal-heating strategy for lithium-ion batteries at low temperature considering both heating time and lifetime reduction von Ruan, Haijun, Jiang, Jiuchun, Sun, Bingxiang, Su, Xiaojia, He, Xitian, Zhao, Kejie

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Ultrasonic-assisted liquid phase diffusion bonding of Al alloys under low temperature and pressure for high-temperature resistance applications von Zhao, Pu, Li, Zhengwei, Xia, Yuanhang, Xu, Zhiwu, Leng, Xuesong, Yan, Jiuchun

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Abnormal rapidly homogenized joining of aluminum alloys through a cross-scale diffusion von Zhao, Pu, Li, Zhengwei, Xu, Zhiwu, Yan, Jiuchun

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Ultrasonic dissolution of solid Al in liquid Sn during soldering: Modeling and equation, trend prediction, accelerating effect von Zhao, Di, Du, Wenkang, Guo, Shu, Xiu, Ziyang, Xu, Zhiwu, Yan, Jiuchun

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Pioglitazone Inhibits Diabetes-Induced Atrial Mitochondrial Oxidative Stress and Improves Mitochondrial Biogenesis, Dynamics, and Function Through the PPAR-γ/PGC-1α Signaling Pathw... von Zhang, Zhiwei, Zhang, Xiaowei, Meng, Lei, Gong, Mengqi, Li, Jian, Shi, Wen, Qiu, Jiuchun, Yang, Yajuan, Zhao, Jianping, Suo, Ya, Liang, Xue, Wang, Xinghua, Tse, Gary, Jiang, Ning, Li, Guangping, Zhao, Yungang, Liu, Tong

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Understanding the formation mechanism of SiC/Al joints by U-TLP bonding with the inactive Zn interlayer von Zhao, Di, Zhao, Chenchen, Xiu, Ziyang, Yan, Jiuchun

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Strengthening mechanism of Al/Sn interfaces: Study from experiments and first-principles calculation von Yan, Han, Guo, Weibing, Luan, Tianmin, Ma, Xinran, Xu, Guojing, Leng, Xuesong, Zhao, Weiwei, Yan, Jiuchun

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Effects of Zn on intermetallic compounds and strength of Al/Mg joints ultrasonically soldered in air von Xu, Zhiwu, Li, Zhengwei, Zhao, Degang, Liu, Xuesong, Yan, Jiuchun

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Grain refinement caused by intensified cavitation within narrow channel and its improvement to ultrasonically soldered Al joint property von Li, Zhengwei, Xu, Zhiwu, Zhao, Degang, Liu, Xuesong, Yan, Jiuchun

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Ultrasonic-assisted transient liquid phase bonding of SiC ceramic and aluminum alloy using an inactive Zn interlayer von Zhao, Di, Du, Wenkang, Xiu, Ziyang, Yan, Jiuchun

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Low‐temperature ultrasound‐activated joining of ZrO2 ceramics using Sn–Al–Cu solder von Dong, Hongjie, Li, Zhuolin, Song, Xiaoguo, Guo, Xiajun, Luo, Yanxu, Bai, Tiansheng, Wei, Shoujing, Zhao, Hongyun, Yan, Jiuchun, Feng, Jicai

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Interfacial wetting and reacting between pyrolytic graphite and Sn–Ag–Cu–Al alloy under ultrasonication at a low temperature von Xu, Guojing, Shi, Xinyue, Li, Zhengwei, Zhao, Pu, Xu, Zhiwu, Yan, Jiuchun

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