A New Class of Electronic Devices Based on Flexible Porous Substrates von Zhang, Yiyuan, Zhang, Tengyuan, Huang, Zhandong, Yang, Jun

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Effects of flow regimes on the interaction between granular flow and flexible barrier von Xiao, Siyou, Xu, Xingqian, Wang, Haijun, Li, Dianxin, Wei, Zhongju, Zhang, Tengyuan

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i3DP, a robust 3D printing approach enabling genetic post-printing surface modification von Wang, Xiaolong, Cai, Xiaobing, Guo, Qiuquan, Zhang, Tengyuan, Kobe, Brad, Yang, Jun

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SU-8-Induced Strong Bonding of Polymer Ligands to Flexible Substrates via in Situ Cross-Linked Reaction for Improved Surface Metallization and Fast Fabrication of High-Quality Flex... von Hu, Mingjun, Guo, Qiuquan, Zhang, Tengyuan, Zhou, Shaolin, Yang, Jun

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React‐on‐Demand (RoD) Fabrication of Highly Conductive Metal–Polymer Hybrid Structure for Flexible Electronics via One‐Step Direct Writing or Printing von Zhang, Tengyuan, Li, Junming, Liu, Jin, Yang, Jun

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Suppressing Corrosion of Aluminum Foils via Highly Conductive Graphene-like Carbon Coating in High-Performance Lithium-Based Batteries von Li, Xia, Deng, Sixu, Banis, Mohammad Norouzi, Doyle-Davis, Kieran, Zhang, Dongxing, Zhang, Tengyuan, Yang, Jun, Divigalpitiya, Ranjith, Brandys, Frank, Li, Ruying, Sun, Xueliang

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Experimental and Theoretical Research on Bending Behavior of Photovoltaic Panels with a Special Boundary Condition von Zhang, Tengyuan, Xie, Lingzhi, Li, Yongxue, Mallick, Tapas, Wei, Qingzhu, Hao, Xia, He, Bo

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Grafting of polyelectrolytes onto hydrocarbon surfaces by high-energy hydrogen induced cross-linking for making metallized polymer films von Wang, Xiaolong, Zhang, Tengyuan, Kobe, Brad, Lau, Woon Ming, Yang, Jun

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Detectability of intracranial vessel wall atherosclerosis using black-blood spectral CT: a phantom and clinical study von Zhang, Fan, Yao, Hui, Langzam, Eran, Meng, Qinglin, Meng, Xiao, van der Geest, Rob J., Luo, Chuncai, Zhang, Tengyuan, Li, Jianyong, Xiong, Jianmei, Deng, Weiwei, Chen, Ke, Zheng, Yangrui, Wu, Jingping, Cui, Fang, Yang, Li

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Teaching NeuroImage: Thickened and Enhanced Cauda Equina as a Manifestation of Acute Lymphoblastic Leukemia Relapse von Li, Jianyong, Zhang, Tengyuan, Cui, Fang

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Direct Pen Writing of Adhesive Particle-Free Ultrahigh Silver Salt-Loaded Composite Ink for Stretchable Circuits von Hu, Mingjun, Cai, Xiaobing, Guo, Qiuquan, Bian, Bin, Zhang, Tengyuan, Yang, Jun

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Paper with Power: Engraving 2D Materials on 3D Structures for Printed, High‐Performance, Binder‐Free, and All‐Solid‐State Supercapacitors von Zhang, Tengyuan, Li, Xia, Asher, Eaton, Deng, Sixu, Sun, Xueliang, Yang, Jun

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Prediction of permeability of various geotechnical materials under different temperatures based on physical characteristics and machine learning von Ma, Shijia, Liu, Jiangfeng, Lin, Yuanjian, Wang, Zhipeng, Zhang, Tengyuan, Jian, Zhijie

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Fabrication of flexible copper-based electronics with high-resolution and high-conductivity on paper via inkjet printing von Zhang, Tengyuan, Wang, Xiaolong, Li, Tingjie, Guo, Qiuquan, Yang, Jun

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Does Trade Policy Uncertainty Exacerbate Environmental Pollution?-Evidence from Chinese Cities von Sun, Yiping, Li, Xiangyi, Zhang, Tengyuan, Fu, Jiawei

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Increased incidence of napkin-ring sign plaques on cervicocerebral computed tomography angiography associated with the risk of acute ischemic stroke occurrence von Wu, Jingping, Zou, Ying, Meng, Xiao, Fan, Zhaoyang, van der Geest, Rob, Cui, Fang, Li, Jianyong, Zhang, Tengyuan, Zhang, Fan

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High-efficiency wireless power transfer system for 3D, unstationary free-positioning and multi-object charging von Zhang, Wei, Zhang, Tengyuan, Guo, Qiuquan, Shao, Lingmin, Zhang, Naibo, Jin, Xiangliang, Yang, Jun

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Hybrid machine learning-based model for predicting chloride ion concentration in coral aggregate concrete and its ethically aligned graphical user interface design von Lv, Wenyu, Sun, Zhen, Li, Yalin, Su, Li, He, Weidong, Zhang, Tengyuan

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Mechanical analysis of photovoltaic panels with various boundary condition von Li, Yongxue, Xie, Lingzhi, Zhang, Tengyuan, Wu, Yupeng, Sun, Yanyi, Ni, Zhichun, Zhang, Jingquan, He, Bo, Zhao, Peng

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A New Printed Electronics Approach Eliminating Redundant Fabrication Process of Vertical Interconnect Accesses: Building Multilayered Circuits in Porous Materials von Zhang, Tengyuan, Asher, Eaton, Yang, Jun

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