Progress in Understanding Color Maintenance in Solid-State Lighting Systems von Yazdan Mehr, Maryam, van Driel, Willem Dirk, Zhang, G. Q. (Kouchi)

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Molecular simulation on the material/interfacial strength of the low-dielectric materials von Yuan, Cadmus A., van der Sluis, Olaf, Zhang, G.Q. (Kouchi), Ernst, Leo J., van Driel, Willem D., van Silfhout, Richard B.R.

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The need for multi-scale approaches in Cu/low- k reliability issues von Yuan, Cadmus A., van der Sluis, Olaf, van Driel, Willem D., Zhang, G.Q. (Kouchi)

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Forcefields based molecular modeling on the mechanical and physical properties of emeraldine base polyaniline von Chen, Xianping, Yuan, Cadmus A., Wong, Cell K.Y., (Kouchi) Zhang, G.Q.

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Towards a System Level Reliability Approach for Solid State Lighting von DRIEL, Willem D. van, EVERTZ, Francis, ZHANG, G.Q., Kouchi

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Solder parameter sensitivity for CSP life-time prediction using simulation-based optimization method von Vandevelde, B., Beyne, E., Zhang, K.G.Q., Caers, J.F.J.M., Vandepitte, D., Baelmans, M.

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Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging von Yuan, Cadmus, Kregting, René, van Driel, Willem, Gielen, Sander, Xiao, An, (Kouchi) Zhang, G. Q.

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The rationale and paradigm of "more than Moore" von Zhang, G.Q., Graef, M., van Roosmalen, F.

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Influence of material combinations on delamination failures in a cavity-down TBGA package von van Driel, W.D., Wisse, G., Chang, A.Y.L., Janssen, J.H.J., Xuejun Fan, Zhang, K.G.Q., Ernst, L.J.

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