A review of current research on occupant-centric control for improving comfort and energy efficiency von Yuan, Yue, Song, Chengcheng, Gao, Liying, Zeng, Kejun, Chen, Yixing

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Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability von Zeng, Kejun, Stierman, Roger, Chiu, Tz-Cheng, Edwards, Darvin, Ano, Kazuaki, Tu, K. N.

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Lead-free soldering: Materials science and solder joint reliability von Zeng, Kejun

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Space-Level air conditioner electricity consumption and occupant behavior analysis on a university campus von Yuan, Yue, Gao, Liying, Zeng, Kejun, Chen, Yixing

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Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective von Zeng, Kejun, Pierce, Mike, Miyazaki, Hiroshi, Holdford, Becky

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Failure mechanism of Ta diffusion barrier between Cu and Si von Laurila, Tomi, Zeng, Kejun, Kivilahti, Jorma K., Molarius, Jyrki, Suni, Ilkka

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Measurement of impact toughness of eutectic SnPb and SnAgCu solder joints in ball grid array by mini-impact tester von Xu, Yuhuan, Ou, Shengquan, Tu, K.N., Zeng, Kejun, Dunne, Rajiv

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Enhanced Operation of Ice Storage System for Peak Load Management in Shopping Malls across Diverse Climate Zones von Su, Fanghan, Wang, Zhiyuan, Yuan, Yue, Song, Chengcheng, Zeng, Kejun, Chen, Yixing, Zhang, Rongpeng

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Dynamic patterns of N6‐methyladenosine profiles of messenger RNA correlated with the cardiomyocyte regenerability in mouse developing heart von Zhang, Liangqing, Yang, Yuhui, Shen, Siman, Zeng, Kejun, Liu, Keyu, Li, Simeng, Chen, Linming, Cai, Yin, Xia, Zhengyuan

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Thermodynamic analysis of the hydriding process of Mg–Ni alloys von Zeng, Kejun, Klassen, T., Oelerich, W., Bormann, R.

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Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards von Kejun Zeng, Vuorinen, V., Kivilahti, J.K.

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Dynamic Patterns of N6-Methyladenosine Profiles of Messenger RNA Correlated with the Cardiomyocyte Regenerability during the Early Heart Development in Mice von Yang, Yuhui, Shen, Siman, Cai, Yin, Zeng, Kejun, Liu, Keyu, Li, Simeng, Zeng, Lanfen, Chen, Linming, Tang, Jing, Hu, Zhe, Xia, Zhengyuan, Zhang, Liangqing

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Retrofit Analysis of Exterior Windows for Large Office Buildings in Different Climate Zones of China von Liu, Sai, Mohamed Ghazali, Farid E, Yang, Jingjing, Guo, Zongkang, Zeng, Kejun, Chen, Yixing

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Thermodynamics of the Ni–H system von Zeng, Kejun, Klassen, T., Oelerich, W., Bormann, R.

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Effect of oxygen on the reactions in the Si/Ta/Cu metallization system von Laurila, Tomi, Zeng, Kejun, Kivilahti, Jorma K., Molarius, Jyriki, Suni, Ilkka

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The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating von Zeng, Kejun, Stierman, Roger, Abbott, Don, Murtuza, Masood

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Thermodynamic analysis of stable and metastable equilibria in the Cu-Cr system von Zeng, Kejun, Hämäläinen, Marko

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Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies von KEJUN ZENG, PIERCE, Mike, MIYAZAKI, Hiroshi, HOLDFORD, Becky

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A thermodynamic calculation of the Ni-Nb phase diagram von Kejun, Zeng, Xianzhang, Zeng, Zhanpeng, Jin

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Effect of Cu content on the interfacial reliability of SnAgCu solder joints von Kejun Zeng, Holdford, B

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