Peritectic Intermetallic Compound (IMC) Morphology of Transient Liquid Phase Solder - A Short Review von Saud, Norainiza, Zan, Muhammad Hafiz Hazizi @, Said, Rita Mohd, Mahim, Zawawi

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Mixing Optimization of Sn-Cu-Si3N4 via Powder Metallurgy Route for Composite Solder Fabrication von Ahmad, Zainal Ariffin, Mohd Salleh, Mohd Arif Anuar, Zan Hazizi, Muhammad Hafiz

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Mixing Optimization of Sn-Cu-Si sub(3)N sub(4) via Powder Metallurgy Route for Composite Solder Fabrication von Hazizi, Muhammad Hafiz Zan, Salleh, M AA Mohd, Ahmad, Zainal Ariffin

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Wettability, Electrical and Mechanical Properties of 99.3Sn-0.7Cu/Si3N4 Novel Lead-Free Nanocomposite Solder von Hazizi, Muhammad Hafiz, Hussin, Kamarudin, Ahmad, Zainal Arifin, Ahmad, Khairel Rafezi, Mohd Salleh, Mohd Arif Anuar

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Compaction Optimization of Sn-Cu-Si3N4 via Powder Metallurgy Route for Composite Solder Fabrication von Mohd Salleh, Mohd Arif Anuar, Abdullah, A., Ahmad, Zainal Ariffin, Hazizi, Muhammad Hafiz Zan, Al Bakri, A.M. Mustafa, Hussin, Kamarudin

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Research Advances of Composite Solder Material Fabricated via Powder Metallurgy Route von Hazizi, Muhammad Hafiz, Ahmad, Zainal A., Mayapan, Ramani, Al Bakri Abdullah, Mohd Mustafa, Mohd Salleh, Mohd Arif Anuar, Noriman, N.Z.

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