TXRF capability of metallic contamination analysis on rough silicon wafers von Yim, Viviane, Mukhtarov, Anna, Drogue, Nathalie, Autillo, Delphine, Lardin, Thierry, Zussy, Marc, Dechamp, Jérôme, Truffier-Boutry, Delphine

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Copper Direct-Bonding Characterization and Its Interests for 3D Integration von Gueguen, Pierric, Di Cioccio, Léa, Gergaud, Patrice, Rivoire, Maurice, Scevola, Daniel, Zussy, Marc, Charvet, Anne Marie, Bally, Laurent, Lafond, Dominique, Clavelier, Laurent

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Elaboration and characterization of a 200 mm stretchable and flexible ultra-thin semi-conductor film von Michaud, L G, Castan, C, Zussy, M, Montméat, P, Mareau, V H, Gonon, L, Fournel, F, Rieutord, F, Tardif, S

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Curved OLED microdisplays von Maindron, Tony, Chambion, Bertrand, Provost, Marion, Vandeneynde, Aurélie, Peray, Patrick, Zussy, Marc, Dechamp, Jérôme, Rossat, Cyrille, Gonnin, Stéphanie

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3D harnessing of light with 2.5D photonic crystals von Viktorovitch, P., Ben Bakir, B., Boutami, S., Leclercq, J. Louis, Letartre, X., Rojo-Romeo, P., Seassal, C., Zussy, M., Di Cioccio, L., Fedeli, J.Marc

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Copper Direct Bonding Characterization and its Interests for 3D Integration Circuits von Gueguen, Pierric, Di Cioccio, Léa, Gergaud, Patrice, Rivoire, Maurice, Scevola, Daniel, Zussy, Marc, Charvet, Anne Marie, Bally, Laurent, Lafond, Dominique, Clavelier, Laurent

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Room-temperature InAs/InP Quantum Dots laser operation based on heterogeneous "2.5 D" Photonic Crystal von Ben Bakir, Badhise, Seassal, Christian, Letartre, Xavier, Regreny, Philippe, Gendry, Michel, Viktorovitch, Pierre, Zussy, Marc, Di Cioccio, Léa, Fedeli, Jean-Marc

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Coupling analysis of heterogeneous integrated InP based photonic crystal triangular lattice band-edge lasers and silicon waveguides von Hattori, Haroldo, Seassal, Christian, Letartre, Xavier, Rojo-Romeo, Pedro, Leclercq, Jean, Viktorovitch, Pierre, Zussy, Marc, di Cioccio, Lea, El Melhaoui, Loubna, Fedeli, Jean-Marc

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Challenges and Progress in Germanium-on-Insulator Materials and Device Development towards ULSI Integration von Augendre, Emmanuel, Sanchez, Loïc, Benaissa, Lamine, Signamarcheix, Thomas, Hartmann, Jean-Michel, Le Royer, Cyrille, Vinet, Maud, Van Den Daele, William, Damlencourt, Jean-François, Romanjek, Krunoslav, Pouydebasque, Arnaud, Batude, Perrine, Tabone, Claude, Mazen, Frédéric, Tauzin, Aurélie, Blanc, Nicolas, Pellat, Michel, Dechamp, Jérôme, Zussy, Marc, Scheiblin, Pascal, Jaud, Marie-Anne, Drazek, Charlotte, Maurois, Cécile, Piccin, Matteo, Abbadie, Alexandra, Lallement, Fabrice, Daval, Nicolas, Guiot, Eric, Rigny, Arnaud, Ghyselen, Bruno, Bourdelle, Konstantin, Boulanger, Fabien, Cristoloveanu, Sorin, Billon, Thierry, Faynot, Olivier, Deguet, Chrystel, Clavelier, Laurent

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PLATE TRIMMING METHOD von MORALES, Christophe, FOURNEL, Frank, ZUSSY, Marc

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METHOD FOR THINNING SAMPLES von ZUSSY, Marc, MORICEAU, Hubert, DECHAMP, Jérôme

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TEMPORARY BONDING METHOD WITH THERMOPLASTIC ADHESIVE INCORPORATING A RIGID RING von Montmeat, Pierre, Fournel, Frank, Zussy, Marc

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PROCESS FOR ASSEMBLING TWO WAFERS AND CORRESPONDING DEVICE von HALIMAOUI AOMAR, ZUSSY MARC

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Process for assembling two wafers and corresponding device von HALIMAOUI AOMAR, ZUSSY MARC

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METHOD FOR WAFER TRIMMING von Morales, Christophe, Fournel, Franck, Zussy, Marc

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Method of manufacturing a mixed microtechnology structure von Kostrzewa, Marek, Zussy, Marc, Moriceau, Hubert

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Method for recycling a substrate holder von Fournel, Frank, Zussy, Marc, Moriceau, Hubert

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PROCEDE D'AMINCISSEMENT D'ECHANTILLONS von MORICEAU, HUBERT, ZUSSY, MARC, DECHAMP, JEROME

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Method for thinning samples von Moriceau Hubert, Zussy Marc, Dechamp Jérôme

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METHOD FOR BUILDING A SUBSTRATE HOLDER von FOURNEL, Frank, BALLY, Laurent, ZUSSY, Marc, JOURDE, Dominique

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