Piezoresistive Characteristics of MOSFET Channels Determined With Indentation von Schlipf, S., Clausner, A., Paul, J., Capecchi, S., Wambera, L., Meier, K., Zschech, E.

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A laboratory X-ray microscopy study of cracks in on-chip interconnect stacks of integrated circuits von Kutukova, K., Niese, S., Sander, C., Standke, Y., Gluch, J., Gall, M., Zschech, E.

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Multi-modal porous microstructure for high temperature fuel cell application von Wejrzanowski, T., Haj Ibrahim, S., Cwieka, K., Loeffler, M., Milewski, J., Zschech, E., Lee, C.-G.

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Porous sandwich ceramic of layered silicon nitride-zirconia composite with various multilayered graphene content von Balázsi, K., Furkó, M., Liao, Z., Gluch, J., Medved, D., Sedlák, R., Dusza, J., Zschech, E., Balázsi, C.

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Quantitative analysis of backscattered electron (BSE) contrast using low voltage scanning electron microscopy (LVSEM) and its application to Al0.22Ga0.78N/GaN layers von Garitagoitia Cid, A., Rosenkranz, R., Löffler, M., Clausner, A., Standke, Y., Zschech, E.

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Si amorphization by focused ion beam milling: Point defect model with dynamic BCA simulation and experimental validation von Huang, J., Loeffler, M., Muehle, U., Moeller, W., Mulders, J.J.L., Kwakman, L.F.Tz, Van Dorp, W.F., Zschech, E.

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Towards monitored tomographic reconstruction: algorithm-dependence and convergence von Bulatov, K.B., Ingacheva, A.S., Gilmanov, M.I., Kutukova, K., Soldatova, Z.V., Buzmakov, A.V., Chukalina, M.V., Zschech, E., Arlazarov, V.V.

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Imaging of microcrack propagation in 3D nanostructures applying laboratory nano-XCT von Zschech, E., Kutukova, K.

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Applying x-ray microscopy and finite element modeling to identify the mechanism of stress-assisted void growth in through-silicon vias von Kong, L. W., Lloyd, J. R., Yeap, K. B, Zschech, E., Rudack, A., Liehr, M., Diebold, A.

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Mechanical characterization of porous nano-thin films by use of atomic force acoustic microscopy von Kopycinska-Müller, M., Clausner, A., Yeap, K.-B., Köhler, B., Kuzeyeva, N., Mahajan, S., Savage, T., Zschech, E., Wolter, K.-J.

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In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures von Meyer, M.A, Herrmann, M, Langer, E, Zschech, E

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Mechanical characterization of nanoporous materials by use of atomic force acoustic microscopy methods von Kopycinska-Müller, M, Yeap, K-B, Mahajan, S, Köhler, B, Kuzeyeva, N, Müller, T, Zschech, E, Wolter, K-J

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Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration von Sander, C., Standke, Y., Niese, S., Rosenkranz, R., Clausner, A., Gall, M., Zschech, E.

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Challenges to quantitative energy-dispersive X-ray spectrometry and its application to graded embedded silicon–germanium for high-performance complementary metal oxide semiconducto... von Hübner, R., Engelmann, H.-J., Zschech, E.

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Novel SThM nanoprobe for thermal properties investigation of micro- and nanoelectronic devices von Janus, P., Szmigiel, D., Weisheit, M., Wielgoszewski, G., Ritz, Y., Grabiec, P., Hecker, M., Gotszalk, T., Sulecki, P., Zschech, E.

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Electromigration early failure void nucleation and growth phenomena in Cu and Cu(Mn) interconnects von Hauschildt, M., Hennesthal, C., Talut, G., Aubel, O., Gall, M., Yeap, K. B., Zschech, E.

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Microstructure effect on EM-induced copper interconnect degradation: Experiment and simulation von Zschech, E., Sukharev, V.

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Structure and thermal stability of graded Ta-TaN diffusion barriers between Cu and SiO2 von HÜBNER, R, HECKER, M, MATTERN, N, HOFFMANN, V, WETZIG, K, WENGER, Ch, ENGELMANN, H.-J, WENZEL, Ch, ZSCHECH, E, BARTHA, J. W

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Effect of nitrogen content on the degradation mechanisms of thin Ta–Si–N diffusion barriers for Cu metallization von Hübner, R., Hecker, M., Mattern, N., Hoffmann, V., Wetzig, K., Heuer, H., Wenzel, Ch, Engelmann, H.-J., Gehre, D., Zschech, E.

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Study of artificial aging in AlMgSi (6061) and AlMgSiCu (6013) alloys by Positron Annihilation von Staab, T. E. M, Krause-Rehberg, R, Hornauer, U, Zschech, E

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