Treffer 1 - 6 von 6 für Suche 'Yu-Jiau Huang', Suchdauer: 0,44s Treffer weiter einschränken
  1. 1
    Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration

    Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration von Ching-Kuan Lee, Tao-Chih Chang, Lau, J. H., Yu-Jiau Huang, Huan-Chun Fu, Jui-Hsiung Huang, Zhi-Cheng Hsiao, Cheng-Ta Ko, Ren-Shin Cheng, Pei-Chen Chang, Kuo-Shu Kao, Yu-Lan Lu, Lo, R., Ming-Jer Kao


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  2. 2
    Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration

    Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration von Ching-Kuan Lee, Tao-Chih Chang, Yu-Jiau Huang, Huan-Chun Fu, Jui-Hsiung Huang, Zhi-Cheng Hsiao, Lau, J. H., Cheng-Ta Ko, Ren-Shin Cheng, Pei-Chen Chang, Kuo-Shu Kao, Yu-Lan Lu, Lo, R., Kao, M. J.


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  3. 3
    Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration

    Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration von Ching-Kuan Lee, Chau-Jie Zhan, Lau, J. H., Yu-Jiau Huang, Huan-Chun Fu, Jui-Hsiung Huang, Zhi-Cheng Hsiao, Shang-Wei Chen, Shin-Yi Huang, Chia-Wen Fan, Yu-Min Lin, Kuo-Shu Kao, Cheng-Ta Ko, Tai-Hung Chen, Lo, R., Kao, M. J.


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  4. 4
    Low temperature micro-bumping assembly technology for 3D integration

    Low temperature micro-bumping assembly technology for 3D integration von Chen, Yu-Hua, Lee, Ching-Kuan, Hsiao, Zhi-Cheng, Chang, Jing-Yao, Zhan, Chau-Jie, Huang, Yu-Jiau, Chen, Shang-Wei, Huang, Shin-Yi, Fan, Chia-Wen, Lin, Yu-Min, Kao, Kuo-Shu, Ko, Cheng-Ta, Lo, Wei-Chung

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  5. 5
    A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application

    A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application von Ko, Cheng-Ta, Hsiao, Zhi-Cheng, Chang, Yao-Jen, Chen, Peng-Shu, Hwang, Yu-Jiau, Fu, Huan-Chun, Huang, Jui-Hsiung, Chiang, Chia-Wen, Sheu, Shyh-Shyuan, Chen, Yu-Hua, Lo, Wei-Chung, Chen, Kuan-Neng


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  6. 6
    Design of multi-field IPv6 packet classifiers using ternary CAMs

    Design of multi-field IPv6 packet classifiers using ternary CAMs von Nen-Fu Huang, Whai-En Chen, Jiau-Yu Luo, Jun-Min Chen

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