Effects of soybean isoflavone on growth performance, meat quality, and antioxidation in male broilers von Jiang, Z.Y, Jiang, S.Q, Lin, Y.C, Xi, P.B, Yu, D.Q, Wu, T.X

Volltext

Investigation of interfacial microstructure and wetting property of newly developed Sn–Zn–Cu solders with Cu substrate von Yu, D.Q., Xie, H.P., Wang, L.

Volltext

Electromigration performance of Through Silicon Via (TSV) – A modeling approach von Tan, Y.C., Tan, C.M., Zhang, X.W., Chai, T.C., Yu, D.Q.

Volltext

Altered thyroid hormone level in offspring exposure to high estrogen level during the first trimester of pregnancy von Lv, P.P, Meng, Y, Li, J.Y, Lv, M, Yu, D.Q, Shen, Y, Dong, S, Ding, G.L, Huang, H.F

Volltext

Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders von Zhao, N., Pan, X.M., Yu, D.Q., Ma, H.T., Wang, L.

Volltext

Improvement of wettability and tensile property in Sn–Ag–RE lead-free solder alloy von Wang, L, Yu, D.Q, Zhao, J, Huang, M.L

Volltext

The growth and roughness evolution of intermetallic compounds of Sn–Ag–Cu/Cu interface during soldering reaction von Yu, D.Q., Wang, L.

Volltext

Properties of lead-free solder alloys with rare earth element additions von Wu, C.M.L., Yu, D.Q., Law, C.M.T., Wang, L.

Volltext

Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements von Yu, D.Q, Zhao, J, Wang, L

Volltext

The variation of the leakage current characteristics of W/Ta2O5/W MIM capacitors with the thickness of the bottom W electrode von Yu, D.Q., Lau, W.S., Wong, Hei, Feng, Xuan, Dong, Shurong, Pey, K.L.

Volltext

Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method von Yu, D.Q., Wu, C.M.L., Law, C.M.T., Wang, L., Lai, J.K.L.

Volltext

The formation of nano-Ag3Sn particles on the intermetallic compounds during wetting reaction von Yu, D.Q., Wang, L., Wu, C.M.L., Law, C.M.T.

Volltext

Five new Diels-Alder type adducts from the stem and root bark of Morus mongolica von Kang, J, Chen, R.Y, Yu, D.Q

Volltext

Microstructural evolution of Sn–9Zn–3Bi solder/Cu joint during long-term aging at 170 °C von Duan, L.L., Yu, D.Q., Han, S.Q., Ma, H.T., Wang, L.

Volltext

Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow von Yu, D.Q., Oppermann, H., Kleff, J., Hutter, M.

Volltext

Nucleation of Ni–Fe alloy near the spinodal von Lü, Y.J., Chen, M., Yang, H., Yu, D.Q.

Volltext

Diterpenoids from the Roots of Suregada glomerulata von Yan, Ren-Yi, Tan, Yong-Xia, Cui, Xi-Qiang, Chen, Ruo-Yun, Yu, De-Quan

Volltext

Effects of Cu Contents in Sn–Cu Solder on the Composition and Morphology of Intermetallic Compounds at a Solder/Ni Interface von Yu, D.Q., Wu, C.M.L., He, D.P., Zhao, N., Wang, L., Lai, J.K.L.

Volltext

Tobacco transcription factor WRKY4 is a modulator of leaf development and disease resistance von Ren, X.J.,China Agricultural Univ., Beijing (China). Coll. of Agriculture and Biotechnology, Huang, W.D.,China Agricultural Univ., Beijing (China). Coll. of Agriculture and Biotechnology, Li, W.Z.,Yunnan Tobacco Science Academy, Yuxi (China). Inst. of Tobacco Agricultural Research, Yu, D.Q.,Chinese Academy of Sciences, Kunming (China). Xishuangbanna Tropical Botanical Garden

Volltext

Photoluminescence investigation of ZnO:P nanoneedle arrays on InP substrate by pulsed laser deposition von Yu, D.Q., Hu, L.Z., Li, J., Hu, H., Zhang, H.Q., Bian, J.M., Zhu, J.X., Qiao, S.S., Chen, X., Wang, B.

Volltext