Wafer dicing process optimization and characterization for C90 low-k wafer technology von Koh Wen Shi, Yow, K.Y., Rachel, K., Calvin, L.

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INTEGRATED CIRCUIT DIE, INTEGRATED CIRCUIT PACKAGE, AND PACKAGING METHOD von YOW K.Y, EU POH LENG

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Laser grooving characterization for dicing defects reduction and its challenges von Koh Wen Shi, Lau Teck Beng, Yow, K.Y.

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Semi-quantitative fluorescent PCR analysis identifies PRKAA1 on chromosome 5 as a potential candidate cancer gene of cervical cancer von Huang, Fung Yu, Chiu, Pui Man, Tam, Kar Fai, Kwok, Yvonne K.Y., Lau, Elizabeth T., Tang, Mary H.Y., Ng, Tong Yow, Liu, Vincent W.S., Cheung, Annie N.Y., Ngan, Hextan Y.S.

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Hydrolysis of palm oil catalyzed by macroporous cation-exchanged resin von Yow, C.J, Liew, K.Y

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Genetic abnormalities and HPV status in cervical and vulvar squamous cell carcinomas von Huang, Fung Yu, Kwok, Yvonne K.Y., Lau, Elizabeth T., Tang, Mary H.Y., Ng, Tong Yow, Ngan, Hextan Y.S.

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