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  1. 1
    Modeling of Practical Substrate Thickness in Multi-Layer Printed Circuit Board for Millimeter-Wave Packaging

    Modeling of Practical Substrate Thickness in Multi-Layer Printed Circuit Board for Millimeter-Wave Packaging von Lee, Dongmin, Lee, Ahnwoo, Kim, Minchul, Choe, Wonseok, Lee, Chungsik, Yoon, Kwansun, Jeong, Mingeun, Kim, Junghyun


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  2. 2
    Modeling of Practical Substrate Thickness in Multilayer Printed Circuit Board for Millimeter-Wave Packaging

    Modeling of Practical Substrate Thickness in Multilayer Printed Circuit Board for Millimeter-Wave Packaging von Lee, Dongmin, Lee, Ahnwoo, Kim, Minchul, Choe, Wonseok, Lee, Chungsik, Yoon, Kwansun, Jeong, Mingeun, Kim, Junghyun


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