Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications von Yin, C.Y., Lu, H., Bailey, C., Chan, Y.C.

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Negative magnetization induced by Mn doping in YCrO3 von Li, C.L., Huang, S., Li, X.X., Zhu, C.M., Zerihun, G., Yin, C.Y., Lu, C.L., Yuan, S.L.

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The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications von Yin, C.Y, Alam, M.O, Chan, Y.C, Bailey, C, Lu, Hua

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Modification of granular activated carbon using low molecular weight polymer for enhanced removal of Cu2+ from aqueous solution von Yin, C.Y, Aroa, M.K, Daud, W.M.A.W

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Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly von Yin, C.Y, Lu, H, Bailey, C, Chan, Y.C

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Effect of annealing temperature on the multiferroic properties of 0.7BiFeO3–0.3Bi0.5Na0.5TiO3 solid solution prepared by sol–gel method von Zhu, C.M., Wang, L.G., Tian, Z.M., Luo, H., Bao, D.L.G.C., Yin, C.Y., Huang, S., Yuan, S.L.

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Ultrasmall nanopores obtained by electric field enhanced one-step anodisation of aluminium alloy von Wang, J.Y., Li, C., Yin, C.Y., Y.H., Wang, Zheng, S.L.

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Different responses of two contrasting Populus davidiana populations to exogenous abscisic acid application von Li, Chunyang, Yin, Chunying, Liu, Shirong

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UNIQUAC model for wax solution with pour point depressant von Chen, W.H., Zhang, X.D., Zhao, Z.C., Yin, C.Y.

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Discovery of Ceratosphaeridium (Acritarcha) from the Ediacaran Doushantuo Formation in Yangtze Gorges, South China and its biostratigraphic implication von Liu, P.J., Yin, C.Y., Chen, S.M., Tang, F., Gao, L.Z.

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Metal-polyethyleneimine-activated Carbon Interaction Parameter at Equilibrium Adsorption Capacity von Yin, C.Y., Aroua, M.K., Daud, W.M.A.W.

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Macromicro modelling of moisture induced stresses in an ACF flip chip assembly von Yin, C.Y., Lu, H., Bailey, C., Chan, Y.C.

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Nonlinear adaptive tracking control for underway replenishment process von Fu, S.H., Cheng, C.C., Yin, C.Y.

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A Physics-of-failure based Prognostic Method for Power Modules von Yin, C.Y., Lu, H., Musallam, M., Bailey, C., Johnson, C.M.

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A prognostic assessment method for power electronics modules von Yin, C.Y., Lu, H., Musallam, M., Bailey, C., Johnson, C.M.

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In-service reliability assessment of solder interconnect in power electronics modules von Yin, C.Y., Lu, H., Musallam, M., Bailey, C., Johnson, C.M.

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Modeling the performance of flexible substrates for lead-free applications von Yin, C.Y., Lu, H., Bailey, C.

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Modeling the Effect of Lead-free Soldering on Flexible Substrates von Rizvi, M.J., Yin, C.Y., Bailey, C.

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Thermal-Mechanical Analysis of Flexible Substrates during Lead-Free Solder Reflow von Yin, C.Y., Rizvi, M.J., Lu, H., Bailey, C.

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Analyzing the Performance of Flexible Substrates for Lead-Free Applications von Yin, C.Y., Lu, H., Bailey, C., Chan, Y.C.

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