Optimal Material Properties of Molding Compounds for MEMS Package von Yeonsung Kim, Hohyung Lee, Xin Zhang, Seungbae Park

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Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound von Yeonsung Kim, Dapeng Liu, Hohyung Lee, Ruiyang Liu, Sengupta, Dipak, Seungbae Park

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ClusterEnG: an interactive educational web resource for clustering and visualizing high-dimensional data von Manjunath, Mohith, Zhang, Yi, Yeo, Steve H, Sobh, Omar, Russell, Nathan, Followell, Christian, Bushell, Colleen, Ravaioli, Umberto, Song, Jun S

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Stress relaxation test of molding compound for MEMS packaging von Yeonsung Kim, Hohyung Lee, Seungbae Park, Xin Zhang

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SequencEnG: an interactive knowledge base of sequencing techniques von Zhang, Yi, Manjunath, Mohith, Kim, Yeonsung, Heintz, Joerg, Song, Jun S

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TeachEnG: a Teach ing En gine for G enomics von Kim, Minji, Kim, Yeonsung, Qian, Lei, Song, Jun S

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TeachEnG: a Teaching Engine for Genomics von Kim, Minji, Kim, Yeonsung, Qian, Lei, Song, Jun S

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Prediction of deformation during manufacturing processes of silicon interposer package with TSVs von Kim, Yeonsung, Park, Ah-Young, Kao, Chin-Li, Su, Michael, Black, Bryan, Park, Seungbae

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Optimization of underfill material for better reliability and thermal behavior of 3D packages with TSVs von Yeonsung Kim, Park, S. B.

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Stress evolution in an encapsulated MEMS package due to viscoelasticity of packaging materials von Seungbae Park, Dapeng Liu, Yeonsung Kim, Hohyung Lee, Zhang, S.

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Low stress integrated device package von Saiyed, Shafi, Goida, Thomas M, Kim, Yeonsung

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LOW STRESS INTEGRATED DEVICE PACKAGE von Saiyed, Shafi, Goida, Thomas M, Kim, Yeonsung

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PACKAGED DEVICES WITH INTEGRATED ANTENNAS von KIM, Yeonsung, KOOK, Youn-Jae, SENGUPTA, Dipak

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Packaged devices with integrated antennas von Sengupta, Dipak, Kook, Youn-Jae, Kim, Yeonsung

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PACKAGED DEVICES WITH INTEGRATED ANTENNAS von KIM, Yeonsung, KOOK, Youn-Jae, SENGUPTA, Dipak

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PACKAGED DEVICES WITH INTEGRATED ANTENNAS von KIM, Yeonsung, KOOK, Youn-Jae, SENGUPTA, Dipak

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PACKAGED DEVICES WITH INTEGRATED ANTENNAS von Sengupta, Dipak, Kook, Youn-Jae, Kim, Yeonsung

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PACKAGED DEVICES WITH INTEGRATED ANTENNAS von KIM, Yeonsung, KOOK, Youn-Jae, SENGUPTA, Dipak

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PACKAGED DEVICES WITH INTEGRATED ANTENNAS von KOOK YOUN-JAE, DIPAK SENGUPTA, KIM YEONSUNG

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PACKAGED DEVICE WITH INTEGRATED ANTENNAS von YOUN-JAE KOOK, YEONSUNG KIM, DIPAK SENGUPTA

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