Treffer 1 - 20 von 417 für Suche 'Yee, Pak', Suchdauer: 0,83s Treffer weiter einschränken
  1. 1
    Effectiveness of Insole Colour on Impact Loading and Lower-Limb Kinematics When Running at Preferred and Nonpreferred Speeds

    Effectiveness of Insole Colour on Impact Loading and Lower-Limb Kinematics When Running at Preferred and Nonpreferred Speeds von Wang, Yi, Lam, Wing-Kai, Pak, Lok-Yee, Wong, Charis K.-W., Tan, Mohammad F., Leung, Aaron K.-L.


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  2. 2
    Does R&D investment drive employment growth? Empirical evidence at industry level from Japan

    Does R&D investment drive employment growth? Empirical evidence at industry level from Japan von Shah, Imran Hussain, Kollydas, Konstantinos, Lee, Pak Yee, Malki, Issam, Chu, Crystal


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  3. 3
    Intellectual property disclosure as threat

    Intellectual property disclosure as threat von Baker, Scott, Lee, Pak Yee, Mezzetti, Claudio


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  4. 4
    Interdisciplinary Educational Collaborations: Chemistry and Computer Science

    Interdisciplinary Educational Collaborations: Chemistry and Computer Science von Woo, Daniel T, Hudson, Benjamin T, Mori, Joji C, Ngan, Evey S. M, Pak, Wing-Yee, Haines, Ronald S

    Veröffentlicht in Journal of chemical education

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  5. 5
    Hierarchy of critical exponents on a Sierpinski honeycomb

    Hierarchy of critical exponents on a Sierpinski honeycomb von Tong, Pak-Yee, Yu, Kin-Wah

    Veröffentlicht in Physics letters. A

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  6. 6
    Fractal networks with a wide distribution of conductances

    Fractal networks with a wide distribution of conductances von Tong, Pak-Yee, Yu, Kin-Wah

    Veröffentlicht in Physics letters. A

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  7. 7
    Intrinsic thermal enhancement for FBGA package

    Intrinsic thermal enhancement for FBGA package von Yee, Pak, Lee, Teck

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  8. 8
    Intrinsic thermal enhancement for FBGA package

    Intrinsic thermal enhancement for FBGA package von Yee, Pak Hong, Lee, Teck Kheng

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  9. 9
    Intrinsic thermal enhancement for FBGA package

    Intrinsic thermal enhancement for FBGA package von LEE TECK KHENG, YEE PAK HONG

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  10. 10
    Intrinsic thermal enhancement for FBGA package

    Intrinsic thermal enhancement for FBGA package von LEE TECK KHENG, YEE PAK HONG

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  11. 11
    Intrinsic thermal enhancement for FBGA package

    Intrinsic thermal enhancement for FBGA package von Yee, Pak Hong, Lee, Teck Kheng

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  12. 12
    INTEGRATED CIRCUIT (IC) TEST ASSEMBLY INCLUDING PHASE CHANGE MATERIAL FOR STABILIZING TEMPERATURE DURING STRESS TESTING OF INTEGRATED CIRCUITS AND METHOD THEREOF

    INTEGRATED CIRCUIT (IC) TEST ASSEMBLY INCLUDING PHASE CHANGE MATERIAL FOR STABILIZING TEMPERATURE DURING STRESS TESTING OF INTEGRATED CIRCUITS AND METHOD THEREOF von YEE, PAK HONG, TAY, WUU YEAN

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  13. 13
    Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof

    Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof von Yee, Pak Hong, Tay, Wuu Yean

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  14. 14
    Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof

    Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof von TAY WUU YEAN, YEE PAK HONG

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  15. 15
    Verbundanordnung, die mehrere Vorrichtungen eingliedert, die unterschiedliche Lichtwellenlängen verwenden, und Verfahren zum Herstellen derselben

    Verbundanordnung, die mehrere Vorrichtungen eingliedert, die unterschiedliche Lichtwellenlängen verwenden, und Verfahren zum Herstellen derselben von ZHANG, JING, YEE, PAK HONG, TAN, WEE SIN

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  16. 16
    Intrinsic thermal enhancement for FBGA package

    Intrinsic thermal enhancement for FBGA package von LEE TECK K, YEE PAK H

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  17. 17
    Intrinsic thermal enhancement for FBGA package

    Intrinsic thermal enhancement for FBGA package von Yee, Pak Hong, Lee, Teck Kheng

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  18. 18
    Intrinsic thermal enhancement for FBGA package

    Intrinsic thermal enhancement for FBGA package von LEE TECK KHENG, YEE PAK HONG

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  19. 19
    Touch input system using light guides

    Touch input system using light guides von Saxena, Kuldeep Kumar, Tan, Wee Sin, Ng, Peng Yam, Yee, Pak Hong, Saravanan, Rani Ramamoorthy

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  20. 20
    Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof

    Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof von Yee, Pak Hong, Tay, Wuu Yean

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