Complete chloroplast genome sequences of Lilium: insights into evolutionary dynamics and phylogenetic analyses von Du, Yun-peng, Bi, Yu, Yang, Feng-ping, Zhang, Ming-fang, Chen, Xu-qing, Xue, Jing, Zhang, Xiu-hai

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Application of the Taguchi method to minimize the non-uniformity of copper deposition in electroplating with numerical model von Yu, Shun-Hsuan, Kao, Chuan-Ping, Ma, Chun-Wei, Fang, Jen-Kuang, Yang, Ping-Feng, Chang, Hou-Chien

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Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples von YANG, Ping-Feng, LAI, Yi-Shao, JIAN, Sheng-Rui, CHEN, Jiunn, CHEN, Rong-Sheng

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Effect of Food Restriction on Food Grinding in Brandt’s Voles von Dai, Xin, Han, Yu-Xuan, Shen, Qiu-Yi, Tang, Hao, Cheng, Li-Zhi, Yang, Feng-Ping, Wei, Wan-Hong, Yang, Sheng-Mei

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Rice husk‐derived porous carbon/silica particles as green filler for electronic package application von Hsieh, Ya‐Yu, Chen, Tsung‐Yi, Kuo, Wei‐Chiao, Lai, Yi‐Shao, Yang, Ping‐Feng, Lin, Hong‐Ping

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Genome Size Diversity in Lilium (Liliaceae) Is Correlated with Karyotype and Environmental Traits von Du, Yun-Peng, Bi, Yu, Zhang, Ming-Fang, Yang, Feng-Ping, Jia, Gui-Xia, Zhang, Xiu-Hai

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Effect of Group Density on the Physiology and Aggressive Behavior of Male Brandt's Voles (Lasiopodomys brandtii) von Dai, Xin, Zhou, Ling-Yu, Cao, Jie-Xia, Zhang, Yan-Qi, Yang, Feng-Ping, Wang, Ai-Qin, Wei, Wan-Hong, Yang, Sheng-Mei

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The physical improvement of copper deposition uniformity with the simulation models von Ma, Chun-Wei, Yu, Shun-Hsuan, Fang, Jen-Kuang, Yang, Ping-Feng, Chang, Hou-Chien

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Atomic-level simulations of nanoindentation-induced phase transformation in mono-crystalline silicon von Lin, Yen-Hung, Chen, Tei-Chen, Yang, Ping-Feng, Jian, Sheng-Rui, Lai, Yi-Shao

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A maize bundle sheath defective mutation mapped on chromosome 1 between SSR markers umc1395 and umc1603 von PAN Yu, CHEN Xu-qing, XIE Hua, DENG Lei, LI Xiang-long, ZHANG Xiao-dong, HAN Li-xin, YANG Feng-ping, XUE Jing, ZHANG Li-quan (1Key Lab of Plant Nutrition and Fertilizers, Ministry of Agriculture/Institute of Agricultural Resources and Regional Planning,Chinese Academy of Agricultural Sciences, Beijing 100081, P.R.China 2College of Land and Environment, Shenyang Agricultural University, Shenyang 110866, P.R.China)

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Effects of bolt pre-loading variations on performance of GDL in a bolted PEMFC by 3-D FEM analysis von Chien, Chi-Hui, Hu, Yao-Lun, Su, Ting-Hsuan, Liu, Hsuan-Ting, Wang, Chung-Ting, Yang, Ping-Feng, Lu, Ying-Xu

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Rapid detection of mango allergen in processed foods using an immunomagnetic nanoparticle-based electrochemical immunosensor von Wu, Ching-Chou, Lin, Chia-Chen, Yin, Hsin-Yi, Tsai, Wen-Che, Yang, Ping-Feng, Liu, Hung-Jen, Wen, Hsiao-Wei

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A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation von Chen, Dao-Long, Yang, Ping-Feng, Lai, Yi-Shao

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Mechanical properties of InGaN thin films deposited by metal-organic chemical vapor deposition von Jian, Sheng-Rui, Jang, Jason Shian-Ching, Lai, Yi-Shao, Yang, Ping-Feng, Yang, Chu-Shou, Wen, Hua-Chiang, Tsai, Chien-Huang

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Evaluation of the nanoindentation behaviors of SiGe epitaxial layer on Si substrate von He, Bo-Ching, Cheng, Chun-Hu, Wen, Hua-Chiang, Lai, Yi-Shao, Yang, Ping-Feng, Lin, Meng-Hung, Wu, Wen-Fa, Chou, Chang-Pin

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Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid von Li, Wen-Hua, Lin, Pei-Syuan, Chen, Chen-Ni, Dong, Teng-Yuan, Tsai, Chi-Hang, Kung, Wan-Ting, Song, Jenn-Ming, Chiu, Ying-Ta, Yang, Ping-Feng

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Nanomechanical properties of Bi2Te3 thin films by nanoindentation von Tasi, Cheng-Hsun, Tseng, Yu-Chin, Jian, Sheng-Rui, Liao, Ying-Yen, Lin, Chih-Ming, Yang, Ping-Feng, Chen, Dao-Long, Chen, Hsueh-Ju, Luo, Chih-Wei, Juang, Jenh-Yih

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Rice husk agricultural waste-derived low ionic content carbon–silica nanocomposite for green reinforced epoxy resin electronic packaging material von Hsieh, Ya-Yu, Tsai, Yun-Chih, He, Jia-Rung, Yang, Ping-Feng, Lin, Hong-Ping, Hsu, Chun-Han, Loganathan, Aswaghosh

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Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition von Lai, Yi-Shao, Yang, Ping-Feng, Yeh, Chang-Lin

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Nanomechanical properties and fracture toughness of Bi3Se2Te thin films grown using pulsed laser deposition von Le, Phuoc Huu, Luo, Chih-Wei, Jian, Sheng-Rui, Lin, Ting-Chun, Yang, Ping-Feng

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