Light Attention Embedding for Facial Expression Recognition von Wang, Cong, Xue, Jian, Lu, Ke, Yan, Yanfu

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Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles von Shi, Yaowu, Liu, Jianping, Yan, Yanfu, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan

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The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder von Li, Chaojun, Yan, Yanfu, Gao, Tingting, Xu, Guodong

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The influence of Ag on the microstructure, thermal properties and mechanical behavior of Sn–25Sb-xAg high temperature lead-free solder von Li, Chaojun, Yan, Yanfu, Gao, Tingting, Xu, Guodong

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Properties of lead-free solder SnAgCu containing minute amounts of rare earth von Chen, Zhigang, Shi, Yaowu, Xia, Zhidong, Yan, Yanfu

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Influence of Mg and Ti on the microstructure and electrochemical performance of aluminum alloy sacrificial anodes von Ma, Jingling, Wen, Jiuba, Li, Xudong, Zhao, Shengli, Yan, Yanfu

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Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles von Shi, Yaowu, Yan, Yanfu, Liu, Jianping, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan

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Fine-Grained Categorization From RGB-D Images von Tan, Yanhao, Rahman, Mohammad Muntasir, Yan, Yanfu, Xue, Jian, Shao, Ling, Lu, Ke

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Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles von Shi, Yaowu, Yan, Yanfu, Liu, Jianping, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan

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Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joints von Yanfu, YAN, Hongxing, YAN, Fuxiao, CHEN, Keke, ZHANG, Jinhong, ZHU

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Effects of Pre-Treatments on Bioactivity of High-Purity Titanium von Wang, Yaming, Wang, Guangxin, Lu, Zhi, Li, Wuhui, Yan, Yanfu, Song, Yongfa, Akiyoshi, Osaka

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Influence of Temperature on Creep Behavior of Ag Particle Enhancement SnCu Based Composite Solder von Yan, Yanfu, Feng, Lifang, Zhang, Keke, Wen, Jiuba

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Hydrothermal solvothermal synthesis potassium sodium niobate lead-free piezoelectric ceramics assisted with microwave von Li, Haitao, Yan, Yanfu, Wang, Guangxin, Li, Qian, Gu, Yongjun, Huang, Jinliang

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Study on Cu particles-enhanced SnPb composite solder von Yan, Yanfu, Liu, Jianping, Shi, Yaowu, Xia, Zhidong

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Preparation of TiO2 Coating on Pure Ti with Sodium Borate Glass as Catalyst von Lu, Zhi, Yan, Yan Fu, Wang, Ya Ming, Wang, Guang Xin

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Influence of temperature on creep behavior of Cu particle enhanced SnPb based composite soldered joints von Yan, Yanfu, Yan, Hongxing, Chen, Fuxiao, Zhang, Keke, Zhu, Jinhong

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Creep rupture and enhancement mechanism of Cu particle enhancement composite solder joints von YAN, Yanfu

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ACER: An AST-based Call Graph Generator Framework von Chen, Andrew, Yan, Yanfu, Poshyvanyk, Denys

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Semantic GUI Scene Learning and Video Alignment for Detecting Duplicate Video-based Bug Reports von Yan, Yanfu, Cooper, Nathan, Chaparro, Oscar, Moran, Kevin, Poshyvanyk, Denys

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Effect of the Er on Resistivity and Spreading Properties of Bi5Sb8Sn Solder Alloy von Yan, Yan Fu, Li, Shuai, Wang, Hong Na, Feng, Li Fang

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