Process integration of single-wafer technology in a 300-mm fab, realizing drastic cycle time reduction with high yield and excellent reliability von Ikeda, S., Nemoto, K., Funabashi, M., Uchino, T., Yamamoto, H., Yabuoshi, N., Sasaki, Y., Komori, K., Suzuki, N., Nishihara, S., Sasabe, S., Koike, A.

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Generation of a Large Electron Beam for Plasma Processing von Sugai, Hideo, Yabuoshi, Noriyuki, Toyoda, Hirotaka

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Innovation of 300 mm fab manufacturing with single wafer technology von Chen, C., Lin, T., Jung, J., Yabuoshi, N., Sasaki, Y., Komori, K., Hsueh Hao Shih, Chao Min Liao, Funabashi, M., Suzuki, N., Ishii, Y., Uchino, T., Nemoto, K., Yamamoto, H., Nishihara, S., Sasabe, S., Koike, A., Ikeda, S., Tsao, J.

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