Treffer 1 - 5 von 5 für Suche 'YU DOKOK', Suchdauer: 0,32s Treffer weiter einschränken
  1. 1
    Simulation and Experiment of Molded Underfill Voids

    Simulation and Experiment of Molded Underfill Voids von Chae, MyoungSu, Ouyang, Eric, Chung, JaeHan, Yu, DokOk, Gu, SeonMo, Kim, Gwang, Ahn, Billy


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  2. 2
    Integrated circuit packaging system with heatsink cap and method of manufacture thereof

    Integrated circuit packaging system with heatsink cap and method of manufacture thereof von KIM GWANGJIN, JUNG HOON, CHUNG JAE HAN, YU DOKOK, YANG JOUNGIN

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  3. 3
    INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEATSINK CAP AND METHOD OF MANUFACTURE THEREOF

    INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEATSINK CAP AND METHOD OF MANUFACTURE THEREOF von KIM GWANGJIN, JUNG HOON, CHUNG JAE HAN, YU DOKOK, YANG JOUNGIN

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  4. 4
    Integrated circuit packaging system with film assistance mold and method of manufacture thereof

    Integrated circuit packaging system with film assistance mold and method of manufacture thereof von LEE JAEHYUN, JANG KI YOUN, YU DOKOK

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  5. 5
    INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ASSISTANCE MOLD AND METHOD OF MANUFACTURE THEREOF

    INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ASSISTANCE MOLD AND METHOD OF MANUFACTURE THEREOF von LEE JAEHYUN, JANG KI YOUN, YU DOKOK

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