Treffer 1 - 20 von 61 für Suche 'YU, YONGSIK', Suchdauer: 0,60s Treffer weiter einschränken
  1. 1
    Ferroelectric and ferroelastic domain structures in epitaxial layers

    Ferroelectric and ferroelastic domain structures in epitaxial layers von Roytburd, Alexander L., Yu, Yongsik

    Veröffentlicht in Ferroelectrics

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  2. 2
    Metal-containing passivation for high aspect ratio etch

    Metal-containing passivation for high aspect ratio etch von Van Cleemput, Patrick, Colinjivadi, Karthik S, Gao, Juwen, Tan, Samantha SiamHwa, Humayun, Raashina, Matamis, George, Lee, Shih-Ked, Yu, Yongsik, Singhal, Akhil, Pan, Yang

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  3. 3
    Metal doped carbon based hard mask removal in semiconductor fabrication

    Metal doped carbon based hard mask removal in semiconductor fabrication von Ghosh, Nikkon, Colinjivadi, Karthik S, Cheung, David Wingto, Yu, Yongsik, Ostrowski, Kirk J, Tan, Samantha, Musselwhite, Nathan, Kawaguchi, Mark Naoshi

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  4. 4
    Staircase encapsulation in 3D NAND fabrication

    Staircase encapsulation in 3D NAND fabrication von van Schravendijk, Bart J, Yu, Yongsik, Varadarajan, Bhadri N, Shankar, Nagraj

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  5. 5
    STAIRCASE ENCAPSULATION IN 3D NAND FABRICATION

    STAIRCASE ENCAPSULATION IN 3D NAND FABRICATION von van Schravendijk, Bart J, Yu, Yongsik, Varadarajan, Bhadri N, Shankar, Nagraj

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  6. 6
    Staircase encapsulation in 3D NAND fabrication

    Staircase encapsulation in 3D NAND fabrication von van Schravendijk, Bart J, Yu, Yongsik, Varadarajan, Bhadri N, Shankar, Nagraj

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  7. 7
    Methods of depositing stable and hermetic ashable hardmask films

    Methods of depositing stable and hermetic ashable hardmask films von Subramonium, Pramod, Yu, Yongsik, Fang, Zhiyuan, Henri, Jon

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  8. 8
    Protective self-aligned buffer layers for damascene interconnects

    Protective self-aligned buffer layers for damascene interconnects von Chattopadhyay, Kaushik, van Schravendijk, Bart, Yu, Yongsik, Sriram, Mandyam

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  9. 9
    HIGH ASPECT RATIO ETCH WITH A LINER

    HIGH ASPECT RATIO ETCH WITH A LINER von MUKHOPADHYAY, Amit, REDDY, Kapu Sirish, WONG, Merrett, VEBER, Gregory Clinton, ROBERTS, Francis Sloan, XU, Qing, YU, Yongsik, PISKUN, Ilya, PUTHENKOVILAKAM, Ragesh

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  10. 10
    HIGH ASPECT RATIO ETCH WITH A RE-DEPOSITED HELMET MASK

    HIGH ASPECT RATIO ETCH WITH A RE-DEPOSITED HELMET MASK von MUKHOPADHYAY, Amit, REDDY, Kapu Sirish, VEBER, Gregory Clinton, WONG, Merrett, MALIEKKAL, Vineet, ROBERTS, Francis Sloan, XU, Qing, YU, Yongsik, PISKUN, Ilya, PUTHENKOVILAKAM, Ragesh

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  11. 11
    Self-Aligned Barrier Improves Interconnect Reliability

    Self-Aligned Barrier Improves Interconnect Reliability von Hui-Jung, Wu, O'loughlin, Jennifer, Shaviv, Roey, Sriram, Mandyam, Chattopadhyay, Kaushik, Yongsik Yu,Tom Mountsier,Bart van Schravendijk, Varadarajan, Sesha, Dixit, Girish, Havemann, Robert

    Veröffentlicht in Semiconductor International

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  12. 12
    Low-k b-doped SiC copper diffusion barrier films

    Low-k b-doped SiC copper diffusion barrier films von Yu, Yongsik, Gupta, Atul, Billington, Karen, Carris, Michael, Crew, William, Mountsier, Thomas W

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  13. 13
    Protective self-aligned buffer layers for damascene interconnects

    Protective self-aligned buffer layers for damascene interconnects von Yu, Yongsik, Sriram, Mandyam, Shaviv, Roey, Chattopadhyay, Kaushik, Wu, Hui-Jung

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  14. 14
    Film for copper diffusion barrier

    Film for copper diffusion barrier von Yu, Yongsik, Billington, Karen, Hepburn, Robert, Carris, Michael, Crew, William

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  15. 15
    Protective self-aligned buffer layers for damascene interconnects

    Protective self-aligned buffer layers for damascene interconnects von Yu, Yongsik, Sriram, Mandyam, Shaviv, Roey, Chattopadhyay, Kaushik, Wu, Hui-Jung

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  16. 16
    Low-k SiC copper diffusion barrier films

    Low-k SiC copper diffusion barrier films von Yu, Yongsik, Billington, Karen, Tang, Xingyuan, Fu, Haiying, Carris, Michael, Crew, William

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  17. 17
    Film for copper diffusion barrier

    Film for copper diffusion barrier von Yu, Yongsik, Billington, Karen, Hepburn, Robert, Carris, Michael, Crew, William

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  18. 18
    Boron-doped SIC copper diffusion barrier films

    Boron-doped SIC copper diffusion barrier films von Yu, Yongsik, Gupta, Atul, Billington, Karen, Carris, Michael, Crew, William, Mountsier, Thomas W

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  19. 19
    Staircase encapsulation in 3D NAND fabrication

    Staircase encapsulation in 3D NAND fabrication von YU, YONGSIK, VAN SCHRAVENDIJK, BART J, VARADARAJAN, BHADRI N, SHANKAR, NAGRAJ

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  20. 20
    METAL-CONTAINING PASSIVATION FOR HIGH ASPECT RATIO ETCH

    METAL-CONTAINING PASSIVATION FOR HIGH ASPECT RATIO ETCH von COLINJIVADI, Karthik S, PAN, Yang, LEE, Shih-Ked, VAN CLEEMPUT, Patrick, MATAMIS, George, YU, Yongsik, HUMAYUN, Raashina, SINGHAL, Akhil, GAO, Juwen, TAN, Samantha SiamHwa

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