Study of the Warp Removal Process for a Thin Substrate: Development of a Correction Processing System Using a Freezing Pin Chuck von Yoshitomi, Kenichiro, Une, Atsunobu

Volltext

Development of High-Speed Rotation Polishing System with Slurry Confinement and Friction-State Control von Yoshitomi, Kenichiro, Shimada, Yoshinori, Une, Atsunobu

Volltext

水膜ポーラスチャックによる薄型基板の高精度保持技術 von 吉冨, 健一郎

Volltext

Study of a clamping process with no deformation for a thin substrate using a freezing pin chuck system von Yoshitomi, Kenichiro, Une, Atsunobu, Tada, Kazuki

Volltext

High Precision Clamping Technique Using a Water-Film Porous Chuck von YOSHITOMI, Kenichiro

Volltext

Reduction of Slurry Flow Rate in Oscillation Polishing Using a Small Tool von YOSHITOMI, Kenichiro, UNE, Atsunobu, MOCHIDA, Masaaki

Volltext

Lapping Simulation Based on the Gap Theory (1st Report): Contact Condition between Workpiece and Tool and Relative Elastic Coefficient von UNE, Atsunobu, GOTO, Kenji, YOSHITOMI, Kenichiro, MOCHIDA, Masaaki

Volltext

Double-Sided Polishing Simulation Based on the Gap Theory - Theory of Pressure Distribution Analysis and Conditions for High Flatness von YOSHITOMI, Kenichiro, UNE, Atsunobu

Volltext

Face Turning of Cobalt-Free Tungsten Carbide Using Nano-Polycrystalline Diamond Tool von Yui, Akinori, Yoshitomi, Kenichiro, Kitajima, Takayuki

Volltext

High Flatness Polishing of Rectangular Glass Materials (2nd Report): Generation of a Center-axisymmetric Shape by Grinding and Compensation Method of Tool Inclination for Polishing... von UNE, Atsunobu, YOSHITOMI, Kenichiro, MOCHIDA, Masaaki

Volltext

Planarization for a Large-sized Wafer by Correction Polishing (1st Report): Pressure Distribution and Contact State between a wafer and a polisher von YOSHITOMI, Kenichiro, UNE, Atsunobu, MOCHIDA, Masaaki

Volltext

Development of a nondeforming chucking technique for EUV lithography von Une, Atsunobu, Ogasawara, Nagahisa, Yoshitomi, Kenichiro, Mochida, Masaaki

Volltext

Fabrication of micro patterns using a drawing system with an air-pulse-type dispenser von YOSHITOMI, Kenichiro, UNE, Atsunobu, MOCHIDA, Masaaki

Volltext

Dynamic deformation of a wafer above a lift hole and influence on flatness due to chucking von Une, Atsunobu, Yoshitomi, Kenichiro, Mochida, Masaaki

Volltext

Development of a nondeforming chucking technique for EUV lithography : Emerging materials and processes for nanoelectronics and sensors von UNE, Atsunobu, OGASAWARA, Nagahisa, YOSHITOMI, Kenichiro, MOCHIDA, Masaaki

Volltext

High Flatness Polishing of Rectangular Glass Materials (1st Report): Simulation of Rectangular Plane Generation by Linear Oscillation von UNE, Atsunobu, YOSHITOMI, Kenichiro, MOCHIDA, Masaaki

Volltext

Simulation on Planarization of a Large Sized Wafer von YOSHITOMI, Kenichiro, UNE, Atsunobu

Volltext

Fabrication of micro patterns using a drawing system with an air-pulse-type dispenser von Yoshitomi, Kenichiro, Une, Atsunobu, Mochida, Masaaki

Volltext

Influence of pin chuck ring seals and polishing steps on wafer flatness von Une, Atsunobu, Yoshitomi, Kenichiro, Mochida, Masaaki, Ogasawara, Nagahisa

Volltext

Development of a Water-Film Chuck (2nd Report): Thinning Method of Water-Film and Wafer Thinning by Grinding von YOSHITOMI, Kenichiro, UNE, Atsunobu, BANDO, Tsubasa, YAMAMOTO, Eiichi

Volltext