Human–AI team halves cost of designing step in microchip fabrication von Wang, Ying-Lang, Huang, Mao-Chih

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Effects of Varied Negative Stop Voltages on Current Self-Compliance in Indium Tin Oxide Resistance Random Access Memory von Chih-Yang Lin, Kuan-Chang Chang, Ting-Chang Chang, Tsung-Ming Tsai, Chih-Hung Pan, Rui Zhang, Kuan-Hsien Liu, Hua-Mao Chen, Yi-Ting Tseng, Ya-Chi Hung, Yong-En Syu, Jin-Cheng Zheng, Ying-Lang Wang, Wei Zhang, Sze, Simon M.

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An electroplating method for copper plane twin boundary manufacturing von Wang, Yu-Sheng, Lee, Wen-Hsi, Chang, Shih-Chieh, Nian, Jun-Nan, Wang, Ying-Lang

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Effect of tungsten incorporation in cobalt tungsten alloys as seedless diffusion barrier materials von Su, Yin-Hsien, Kuo, Tai-Chen, Lee, Wen-Hsi, Wang, Yu-Sheng, Hung, Chi-Cheng, Tseng, Wei-Hsiang, Wei, Kuo-Hsiu, Wang, Ying-Lang

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Characterization of interface quality between various low-temperature oxides and Si using room-temperature-photoluminescence and Raman spectroscopy von Jang Jian, Shiu-Ko, Jeng, Chih-Cherng, Wang, Ting-Chun, Huang, Chih-Mu, Wang, Ying-Lang, Yoo, Woo Sik

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Interfacial reactions between Cu and SnAgCu solder doped with minor Ni von Cheng, Hsi-Kuei, Huang, Chin-Wen, Lee, Hsuan, Wang, Ying-Lang, Liu, Tzeng-Feng, Chen, Chih-Ming

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Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning von Wei, Kuo-Hsiu, Hung, Chi-Cheng, Wang, Yu-Sheng, Liu, Chuan-Pu, Chen, Kei-Wei, Wang, Ying-Lang

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Visualization of Plasma Etching Damage of Si Using Room Temperature Photoluminescence and Raman Spectroscopy von Jang Jian, Shiu-Ko, Jeng, Chih-Cherng, Wang, Ting-Chun, Huang, Chih-Mu, Wang, Ying-Lang, Sik Yoo, Woo

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A Study on the Diffuse Mechanism and the Barrier Property of Copper Manganese Alloy on Tantalum von Su, Ying-Sen, Lee, Wen-Hsi, Chang, Shih-Chieh, Wang, Ying-Lang

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The influence of abrasive particle size in copper chemical mechanical planarization von WEI, Kuo-Hsiu, WANG, Yu-Sheng, LIU, Chuan-Pu, CHEN, Kei-Wei, WANG, Ying-Lang, CHENG, Yi-Lung

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Suppression Effect of Low-Concentration Bis-(3-sodiumsulfopropyl disulfide) on Copper Electroplating von Hung, Chi-Cheng, Lee, Wen-Hsi, Chang, Shih-Chieh, Chen, Kei-Wei, Wang, Ying-Lang

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Silicon introduced effect on resistive switching characteristics of WO X thin films von Syu, Yong-En, Chang, Ting-Chang, Tsai, Tsung-Ming, Chang, Geng-Wei, Chang, Kuan-Chang, Tai, Ya-Hsiang, Tsai, Ming-Jinn, Wang, Ying-Lang, Sze, Simon M.

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A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization von Kuo, Tai-Chen, Su, Yin-Hsien, Lee, Wen-Hsi, Liao, Wei -Hsiang, Wang, Yu-Sheng, Hung, Chi-Cheng, Wang, Ying-Lang

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Microstructural Evolution of Cu/Solder/Cu Pillar-Type Structures with Different Diffusion Barriers von Cheng, Hsi-Kuei, Lin, Yu-Jie, Chen, Chih-Ming, Liu, Kuo-Chio, Wang, Ying-Lang, Liu, Tzeng-Feng

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Effect of Electric Potential and Mechanical Force on Copper Electro-Chemical Mechanical Planarization von Chen, Sheng-Wen, Kung, Te-Ming, Liu, Chuan-Pu, Chang, Shih-Chieh, Cheng, Yi-Lung, Wang, Ying-Lang

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Re-examination of pressure and speed dependences of removal rate during chemical-mechanical polishing processes von TSENG, W.-T, WANG, Y.-L

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A study on annealing mechanisms with different manganese contents in CuMn alloy von Wu, Chia-Yang, Wu, Chi-Ting, Lee, Wen-Hsi, Chang, Shih-Chieh, Wang, Ying-Lang

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Plasma treatment effects on hydrogenated amorphous carbon films prepared by plasma-enhanced chemical vapor deposition von Wu, Jun, Wang, Ying-Lang, Kuo, Cheng-Tzu

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Evolution of Fluorine Content with Precipitate Formation in Fluorine-Doped Silicon Oxide von Wu, Jun, Wang, Ying-Lang, Kuo, Cheng-Tzu, Pan, Fu-Ming

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How tantalum proceeds phase change on tantalum nitride underlayer with sequential Ar plasma treatment von Tsao, Jung-Chih, Liu, Chuan-Pu, Fang, Hsin-Chiao, Wang, Ying-Lang

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