A Compact Sixth-order Common-Mode Noise Suppression Filter Based on 3-D Integration Technology von Wang, Fengjuan, Hou, Cangcang, Yin, Xiangkun, Yu, Ningmei, Yang, Yuan

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An Effective Approach of Reducing the Keep-Out-Zone Induced by Coaxial Through-Silicon-Via von Wang, Fengjuan, Zhu, Zhangming, Yang, Yintang, Yin, Xiangkun, Liu, Xiaoxian, Ding, Ruixue

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Metal Proportion Optimization of Annular Through-Silicon via Considering Temperature and Keep-Out Zone von Yin, Xiangkun, Zhu, Zhangming, Yang, Yintang, Ding, Ruixue

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3-D Compact 3-dB Branch-Line Directional Couplers Based on Through-Silicon Via Technology for Millimeter-Wave Applications von Lu, Qijun, Zhu, Zhangming, Shan, Guangbao, Liu, Yang, Liu, Xiaoxian, Yin, Xiangkun

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Compact TSV-Based Hairpin Bandpass Filter for Thz Applications von Wang, Fengjuan, Ke, Lei, Yin, Xiangkun, Yu, Ningmei, Yang, Yuan

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Evaluation of the Performance of Low-Cost Air Quality Sensors at a High Mountain Station with Complex Meteorological Conditions von Li, Hongyong, Zhu, Yujiao, Zhao, Yong, Chen, Tianshu, Jiang, Ying, Shan, Ye, Liu, Yuhong, Mu, Jiangshan, Yin, Xiangkun, Wu, Di, Zhang, Cheng, Si, Shuchun, Wang, Xinfeng, Wang, Wenxing, Xue, Likun

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Compact Bandpass Filter and Diplexer With Wide-Stopband Suppression Based on Balanced Substrate-Integrated Waveguide von Liu, Xiaoxian, Zhu, Zhangming, Liu, Yang, Lu, Qijun, Yin, Xiangkun, Yang, Yintang

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A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application von Wang, Fengjuan, Zhang, Kai, Yin, Xiangkun, Yu, Ningmei, Yang, Yuan

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Ultra-Compact TSV-Based L-C Low-Pass Filter With Stopband Up to 40 GHz for Microwave Application von Yin, Xiangkun, Zhu, Zhangming, Liu, Yang, Lu, Qijun, Liu, Xiaoxian, Yang, Yintang

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Effectiveness of p + Layer in Mitigating Substrate Noise Induced by Through-Silicon Via for Microwave Applications von Yin, Xiangkun, Zhu, Zhangming, Yang, Yintang, Ding, Ruixue

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A T-Model With Parameter Extraction Method for Modeling 3-D Spiral Inductor von Liu, Yang, Liu, Xiaoxian, Lu, Qijun, Zhang, Tao, Yin, Xiangkun

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A 3-D Integrated Common Mode Filter Based on Through Silicon vias Technology von Wang, Fengjuan, Huang, Haoxiang, Yin, Xiangkun, Yu, Ningmei, Yang, Yuan

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A Miniaturized Wideband SIR Interdigital Bandpass Filter with High Performance Based on TSV Technology for W-Band Application von Wang, Fengjuan, Zhang, Kai, Yin, Xiangkun, Yu, Ningmei, Yang, Yuan

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A Miniatured Passive Low-Pass Filter With Ultrawide Stopband Based on 3-D Integration Technology von Yin, Xiangkun, Wang, Fengjuan, Lu, Qijun, Liu, Xiaoxian, Liu, Yang, Yang, Yintang

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Wideband Electromagnetic Modeling of Coaxial-Annular Through-Silicon Vias von Lu, Qijun, Zhu, Zhangming, Liu, Yang, Liu, Xiaoxian, Yin, Xiangkun

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A Fully Symmetric High-Performance Transformer Balun Based on TSV for RF Applications von Wang, Fengjuan, Zhang, Dingxi, Yin, Xiangkun, Yu, Ningmei, Yang, Yuan

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Miniature and Symmetrical Transformer Based on Through-Silicon Vias von Wang, Fengjuan, Ren, Ruinan, Yin, Xiangkun, Yu, Ningmei, Yang, Yuan

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A transformer with high coupling coefficient and small area based on TSV von Wang, Fengjuan, Ren, Ruinan, Yin, Xiangkun, Yu, Ningmei, Yang, Yuan

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A compact fifth-order SIW BPF based on TSV technology with high selectivity von Wang, Fengjuan, Kou, Jilin, Yin, Xiangkun, Liu, Jiangfan, Jing, Kai, Yu, Ningmei, Yang, Yuan, Li, Qian

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A High Coupling Coefficient and Symmetric Transformer Based on TSV von Deng, Yue, Wang, Fengjuan, Yin, Xiangkun, Yang, Yuan, Yu, Ningmei, Li, Yan

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