Thermal Properties of Carbon Nanotube–Copper Composites for Thermal Management Applications von Chu, Ke, Guo, Hong, Jia, Chengchang, Yin, Fazhang, Zhang, Ximin, Liang, Xuebing, Chen, Hui

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Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications von Zhang, Ximin, Guo, Hong, Yin, Fazhang, Fan, Yeming, Zhang, Yongzhong

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Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle sizes prepared by pressure infiltration method von Chen, Chao, Guo, Hong, Chu, Ke, Yin, Fazhang, Zhang, Ximing, Han, Yuanyuan, Fan, Yeming

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Microstructure and thermal conductivity of copper matrix composites reinforced with mixtures of diamond and SiC particles von Han, Yuanyuan, Guo, Hong, Yin, Fazhang, Zhang, Ximin, Chu, Ke, Fan, Yeming

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Pressure infiltrated Cu/diamond composites for LED applications von Fan, Yeming, Guo, Hong, Xu, Jun, Chu, Ke, Zhu, Xuexin, Jia, Chengchang, Yin, Fazhang, Zhang, Ximin

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Thermal Performance Analysis of LED with Multichips von Han, Yuanyuan, Guo, Hong, Zhang, Ximin, Yin, Fazhang, Chu, Ke, Fan, Yeming

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Thermal Properties of Carbon Nanotube-Copper Composites for Thermal Management Applications von Chu, Ke, Guo, Hong, Jia, Chengchang, Yin, Fazhang, Zhang, Ximin, Liang, Xuebing, Chen, Hui

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Electronic packaging materials prepared by powder injecting molding and pressure infiltration process von YIN, Fazhang, GUO, Hong, JIA, Chengchang, XU, Jun, ZHANG, Ximin, ZHU, Xuexin

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Experimental and modeling study of the thermal conductivity of SiCp/Al composites with bimodal size distribution von Chu, Ke, Jia, Chengchang, Liang, Xuebing, Chen, Hui, Guo, Hong, Yin, Fazhang, Qu, Xuanhui

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Microstructure and thermal conductivity of copper matrix composites reinforced with mixtures of diamond and SiC particles von HAN Yuanyuan, GUO Hong, YIN Fazhang, ZHANG Ximin, CHU Ke, FAN Yeming

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Thermal Analysis of High Power Light Emitting Diodes Package von Yao, Ou Yang, Guo, Hong, Zhang, Xi Min, Chu, Ke, Han, Yuan Yuan, Yin, Fa Zhang

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Manufacture of Al/SiC Composites by Pressure Infiltration Process von Jia, Cheng Chang, Yin, Fa Zhang, Ping, Yanlei, Qu, Xuan Hui, Mei, Xuezhen, Ye, Bin

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Manual-electric winch von WANG SHIMING, YIN FAZHANG, CHEN XIAOYU

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Tungsten-molybdenum nanometer film-coated diamond and preparation method thereof von HAN YUANYUAN, FAN YEMING, XU JUN, ZHANG XIMIN, YIN FAZHANG, GUO HONG, ZHANG YONGZHONG

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Layer-shaped high thermal conductive and insulating base plate and preparation method thereof von HAN YUANYUAN, FAN YEMING, XU JUN, ZHANG XIMIN, YIN FAZHANG, GUO HONG

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Composite-structure highly-oriented heat conducting material and preparation method thereof von HAN YUANYUAN, FAN YEMING, ZHANG XIMIN, YIN FAZHANG, GUO HONG, ZHANG YONGZHONG

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High-thermal-conductivity lamellar graphite/aluminum composite material and preparation method thereof von HAN YUANYUAN, FAN YEMING, XU JUN, ZHANG XIMIN, YIN FAZHANG, GUO HONG, ZHANG YONGZHONG

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Niobium alloy surface Ni-Cr oxidation-resistant coating and preparation method thereof von HAN YUANYUAN, FAN YEMING, ZHANG XIMIN, YIN FAZHANG, ZHANG YONGZHONG, GUO HONG

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Reliable data transmission system based on beidou satellite von LIU WENBIN, YIN XIANWEN, WANG ZHANXING, LIU HANCHEN, YANG GUANGYUN, DU CHUNHUI, LI YUKUI, WANG CHUNLEI, YIN FAZHANG

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Reliable data transmission method based on Beidou satellite von LIU WENBIN, YIN XIANWEN, YANG GUANGYUN, WANG ZHANXING, LIU HANCHEN, DU CHUNHUI, LI YUKUI, WANG CHUNLEI, YIN FAZHANG

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