Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples von YANG, Ping-Feng, LAI, Yi-Shao, JIAN, Sheng-Rui, CHEN, Jiunn, CHEN, Rong-Sheng

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Rice husk‐derived porous carbon/silica particles as green filler for electronic package application von Hsieh, Ya‐Yu, Chen, Tsung‐Yi, Kuo, Wei‐Chiao, Lai, Yi‐Shao, Yang, Ping‐Feng, Lin, Hong‐Ping

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Exploring Information Warfare Strategies during the Russia–Ukraine War on Twitter von Shu–Min Hou, Wen-Cheng Fu, Shao–Yi Lai

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Effect of current crowding on whisker growth at the anode in flip chip solder joints von Ouyang, Fan-Yi, Chen, Kai, Tu, K. N., Lai, Yi-Shao

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Investigation of growth behavior of Al–Cu intermetallic compounds in Cu wire bonding von Chen, Jiunn, Lai, Yi-Shao, Wang, Yi-Wun, Kao, C.R.

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Effect of electromigration induced joule heating and strain on microstructural recrystallization in eutectic SnPb flip chip solder joints von Ouyang, Fan-Yi, Tu, K.N., Lai, Yi-Shao

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Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints von Liang, Y. C., Tsao, W. A., Chen, Chih, Yao, Da-Jeng, Huang, Annie T., Lai, Yi-Shao

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Fine pitch copper wire bonding in high volume production von Appelt, Bernd K., Tseng, Andy, Chen, Chun-Hsiung, Lai, Yi-Shao

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In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction von Chen, Kai, Tamura, N., Kunz, M., Tu, K. N., Lai, Yi-Shao

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Cross-sectional transmission electron microscopy observations of structural damage in Al0.16Ga0.84N thin film under contact loading von Jian, Sheng-Rui, Juang, Jenh-Yih, Lai, Yi-Shao

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Evaluation of solder joint strengths under ball impact test von Lai, Yi-Shao, Chang, Hsiao-Chuan, Yeh, Chang-Lin

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Effects of solder alloy constitutive relationships on impact force responses of package- level solder joints under ball impact test von YEH, Chang-Lin, LAI, Yi-Shao

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Atomic-level simulations of nanoindentation-induced phase transformation in mono-crystalline silicon von Lin, Yen-Hung, Chen, Tei-Chen, Yang, Ping-Feng, Jian, Sheng-Rui, Lai, Yi-Shao

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Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration von Liang, S. W., Chen, Chih, Han, J. K., Xu, Luhua, Tu, K. N., Lai, Yi-Shao

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Effects of different drop test conditions on board-level reliability of chip-scale packages von Lai, Yi-Shao, Yang, Po-Chuan, Yeh, Chang-Lin

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Cross-sectional transmission electron microscopy observations on the Berkovich indentation-induced deformation microstructures in GaN thin films von Chien, Chi-Hui, Jian, Sheng-Rui, Wang, Chung-Ting, Juang, Jenh-Yih, Huang, J C, Lai, Yi-Shao

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Effect of the combination of surface finishes and solder balls on JEDEC drop reliability of chip-scale packages von Wang, Tong Hong, Tsai, Chung-Hung, Lai, Yi-Shao

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Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints von Song, Jenn-Ming, Liu, Yao-Ren, Lai, Yi-Shao, Chiu, Ying-Ta, Lee, Ning-Cheng

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Local melting induced by electromigration in flip-chip solder joints von TSAI, C. M, LIN, Y. L, TSAI, J. Y, LAI, Yi-Shao, KAO, C. R

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A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation von Chen, Dao-Long, Yang, Ping-Feng, Lai, Yi-Shao

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