Advanced tungsten plug process for beyond nanometer technology von Luoh, Tuung, Su, Chin-Ta, Yang, Ta-Hung, Chen, Kuang-Chao, Lu, Chih-Yuan

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Improvement of the properties and electrical performance on TiCl4-based TiN film using sequential flow chemical vapor deposition process von CHENG, Ming-Da, LUOH, Tuung, SU, Chin-Ta, YANG, Ta-Hung, CHEN, Kuang-Chao, LU, Chih-Yuan

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Inter-metal inorganic spin-on-glass dielectric layer in 100 nm generation technology von Cheng, Ming Da, Luoh, Tuung, Su, Chin Ta, Yang, Ta Hung, Chen, Kuang Chao, Lu, Chih Yuan

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Improvement of the properties and electrical performance on TiCl 4-based TiN film using sequential flow chemical vapor deposition process von Cheng, Ming-Da, Luoh, Tuung, Su, Chin-Ta, Yang, Ta-Hung, Chen, Kuang-Chao, Lu, Chih-Yuan

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Word line structure and method of manufacturing the same von Chen, Chi-Min, Yang, Ta-Hung, Hung, Yung-Tai, Luoh, Tuung, Chen, Kuang-Chao

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WORD LINE STRUCTURE AND METHOD OF MANUFACTURING THE SAME von Chen, Chi-Min, Yang, Ta-Hung, Hung, Yung-Tai, Luoh, Tuung, Chen, Kuang-Chao

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3D MEMORY DEVICE WITH LAYERED CONDUCTORS von Huang, Yukai, Yang, Ta-Hung, Luoh, Tuung, Chen, Kuang-Chao

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3D MEMORY DEVICE WITH LAYERED CONDUCTORS von CHEN, Kuang-Chao, YANG, Ta-Hung, HUANG, Yukai, LUOH, Tuung

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Inverted-T shaped via for reducing adverse stress-migration effects von Hong Shih-Ping, Chen Yen-Lu, Yang Ta Hung

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3D INTEGRATED CIRCUIT DEVICE HAVING A BUTTRESS STRUCTURE FOR RESISTING DEFORMATION von Yang, Ta-Hung, Hung, Yung-Tai, Luoh, Tuung, Chen, Kuang-Chao

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Integrated circuit device with layered trench conductors von Huang, Yukai, Yang, Ta-Hung, Hung, Yung-Tai, Cheng, Chun Min, Yang, Ling Wuu, Luoh, Tuung, Chiang, Chun Ling, Chen, Kuang-Chao

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INTEGRATED CIRCUIT DEVICE WITH LAYERED TRENCH CONDUCTORS von CHEN, Kuang-Chao, CHIANG, Chun Ling, HUNG, Yung-Tai, CHENG, Chun Min, YANG, Ling Wuu, YANG, Ta-Hung, HUANG, Yukai, LUOH, Tuung

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INTEGRATED CIRCUIT DEVICE WITH LAYERED TRENCH CONDUCTORS von CHEN, Kuang-Chao, CHIANG, Chun Ling, HUNG, Yung-Tai, CHENG, Chun Min, YANG, Ling Wuu, YANG, Ta-Hung, HUANG, Yukai, LUOH, Tuung

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ISOLATION STRUCTURE AND METHOD FOR FABRICATING THE SAME von Chen Kuang-Chao, Yang Ta-Hung, Luoh Tuung, Yeh Chin-Tsan

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Controlling system and method for operating the same von Lo, Chao-Lung, Yang, Ta-Hung

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Lithography systems and processes von Wu, Tzong Hsien, Yang, Ta Hung, Lu, Chih Yuan

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Multivariate monitoring method for plasma process machine von Luoh, Tuung, Luo, Shing-Ann, Su, Chin-Ta, Yang, Ta-Hung, Chen, Kuang-Chao

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Method of forming dielectric layer von Yu, Hsu-Sheng, Lo, Shing-Ann, Yang, Ta-Hung

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Patterning method and patterning device von YANG TA-HUNG

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HDP-CVD process, filling-in process utilizing HDP-CVD, and HDP-CVD system von Luoh, Tuung, Su, Chin-Ta, Yang, Ta-Hung, Chen, Kuang-Chao, Luo, Shing-Ann

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