Promising electroplating solution for facile fabrication of Cu quantum point contacts von Yang, Yang, Liu, Junyang, Zheng, Jueting, Lu, Miao, Shi, Jia, Hong, Wenjing, Yang, Fangzu, Tian, Zhongqun

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An Electrochemically Assisted Mechanically Controllable Break Junction Approach for Single Molecule Junction Conductance Measurements von Yang, Yang, Chen, Zhaobin, Liu, Junyang, Lu, Miao, Yang, Dezhi, Yang, Fangzu, Tian, Zhongqun

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Synthesis and Characterization of a Novel Dialdehyde and Cyclic Anhydride von Wu, Liqiong, Feng, Li, Zhang, Hong, Liu, Qixuan, He, Xumin, Yang, Fangzu, Xia, Haiping

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Copper Deposition on Au(111) in a Deep Eutectic Solvent: An In Situ STM Study von Tan, Zhuo, Liu, Shuai, Wu, Jiedu, Nan, Ziang, Yang, Fangzu, Zhan, Dongping, Yan, Jiawei, Mao, Bingwei

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Advances in Pretreatments for Electroless Copper Plating on Polymer Materials von Zheng, Anni, Jin, Lei, Yang, Jiaqiang, Li, Weiqing, Wang, Zhaoyun, Yang, Fangzu, Zhan, Dongping, Tian, Zhongqun

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Competitive Effects of Surface Plasmon Resonances and Interband Transitions on Plasmon-Enhanced Second-Harmonic Generation at Near-Ultraviolet Frequencies von Shen, Shaoxin, Shan, Jiejie, Shih, Tien-Mo, Han, Junbo, Ma, Zongwei, Zhao, Feng, Yang, Fangzu, Zhou, Yongliang, Yang, Zhilin

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Synthesis, Characterization and Electrochemical Properties of Stable Osmabenzenes Containing PPh3 Substituents von Zhang, Hong, Wu, Liqiong, Lin, Ran, Zhao, Qianyi, He, Guomei, Yang, Fangzu, Wen, Ting Bin, Xia, Haiping

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Synthesis and Characterization of Stable Ruthenabenzenes Starting from HC⋮CCH(OH)C⋮CH von Zhang, Hong, Feng, Li, Gong, Lei, Wu, Liqiong, He, Guomei, Wen, Tingbin, Yang, Fangzu, Xia, Haiping

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Synthesis, Characterization and Electrochemical Properties of Stable Osmabenzenes Containing PPh 3 Substituents von Zhang, Hong, Wu, Liqiong, Lin, Ran, Zhao, Qianyi, He, Guomei, Yang, Fangzu, Wen, Ting Bin, Xia, Haiping

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Synthesis and characterization of a bimetallic iridium complex with a ten sp2-carbon chain bridge von Gong, Lei, Wu, Liqiong, Lin, Yumei, Zhang, Hong, Yang, Fangzu, Wen, Tingbin, Xia, Haiping

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Acid sulfate electronic copper electroplating additive composition and application thereof von YANG FANGZU, WANG ZHAOYUN, YANG JIAQIANG, SUN SHIGANG, JIN LEI

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ACID SULFATE ELECTROPLATING COPPER COMBINATION ADDITIVE FOR DENSE FILLING OF PCB THROUGH HOLE METAL von YANG, Jiaqiang, TIAN, Zhongqun, ZHAN, Dongping, WANG, Zhaoyun, ZHENG, Anni, JIN, Lei, YANG, Fangzu

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LOW-COPPER-SALT WEAKLY-ALKALINE ELECTRONIC COPPER ELECTROPLATING LIQUID FOR COMPACT COPPER FILLING OF PCB BLIND HOLE, AND ELECTROPLATING METHOD THEREFOR von YANG, Jiaqiang, TIAN, Zhongqun, ZHAN, Dongping, WANG, Zhaoyun, ZHENG, Anni, JIN, Lei, YANG, Fangzu

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Acid copper plating solution additive for filling through-silicon-via copper, acid copper plating solution and copper metal filling method of through-silicon-via von YANG FANGZU, LIU JUNYANG, WANG ZHAOYUN, YANG JIAQIANG, ZHAN DONGPING, ZHAO JIAOYANG, JIN LEI

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Method, device, equipment and medium for determining concentration of additive in acidic copper plating solution based on ultramicroelectrode von YANG FANGZU, TIAN ZHONGQUN, ZHAO YI, WANG ZHAOYUN, YANG JIAQIANG, ZHAN DONGPING, JIN LEI

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Electronic electroplating additive composition and application thereof in inhibition of transverse electrodeposition of silver-ferrite interface nickel von ZENG XIANGDONG, YANG FANGZU, YANG JIAQIANG, ZHAN DONGPING, WANG MEI, XU GUANG, JIN LEI

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SILVER COLLOID ACTIVATION SOLUTION COMPOSITION FOR CHEMICAL COPPER PLATING METALLIZATION ON SURFACE OF POLYMER AND PREPARATION METHOD FOR SILVER COLLOID ACTIVATION SOLUTION COMPOSI... von YANG, Jiaqiang, TIAN, Zhongqun, ZHAN, Dongping, WANG, Zhaoyun, ZHENG, Anni, YANG, Fangzu, JIN, Lei, LI, Weiqing

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Acid sulfate electronic copper electroplating combined additive for dense filling of PCB through hole metal von YANG FANGZU, TIAN ZHONGQUN, WANG ZHAOYUN, ZHENG ANNI, YANG JIAQIANG, ZHAN DONGPING, JIN LEI

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Low-copper-salt weakly-alkaline electronic copper electroplating liquid for compact copper filling of PCB blind hole and application of low-copper-salt weakly-alkaline electronic c... von YANG FANGZU, TIAN ZHONGQUN, ZHENG ANNI, WANG ZHAOYUN, YANG JIAQIANG, ZHAN DONGPING, JIN LEI

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Silver colloid activating solution composition for chemical copper plating metallization on surface of polymer and preparation method of silver colloid activating solution composit... von YANG FANGZU, TIAN ZHONGQUN, LI WEIQING, ZHENG ANNI, WANG ZHAOYUN, YANG JIAQIANG, ZHAN DONGPING, JIN LEI

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