Effects of Kovar-4J29 Cylinder Resonance on Ultrasonic Wire Bonding von Xiao, Jinqing, Li, Junhui

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Comparison of interfacial reactions and isothermal aging of cone Ni-P and flat Ni-P with Sn3.5Ag solders von Xiao, Jinqing, Wang, Fuliang, Li, Junhui, Chen, Zhuo

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Laser lift-off mechanism and optical-electric characteristics of red Micro-LED devices von Tian, Wenya, Wu, Yongshuan, Xiao, Jinqing, Wang, Pengkai, Li, Junhui

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Full-color micro-LED displays with cadmium-free quantum dots patterned by photolithography technology von Tian, Wenya, Dou, Long, Jin, Zhong, Xiao, Jinqing, Li, Junhui

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Full-color micro-LED displays with cadmium-free quantum dots patterned by photolithography technology: retraction von Tian, Wenya, Dou, Long, Jin, Zhong, Xiao, Jinqing, Li, Junhui

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RETRACTED: Full-color micro-LED displays with cadmium-free quantum dots patterned by photolithography technology von Tian, Wenya, Dou, Long, Jin, Zhong, Xiao, Jinqing, Li, Junhui

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Theoretical study on tin oxide surface chemistry mechanism and thermodynamic properties for atomic layer deposition equipment optimization von Wang, Pengkai, Wu, Yongshuan, Wu, Tianxiang, Xiao, Jinqing, Xu, Wei, Peng, Yichang, Li, Junhui

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Optical–electrical characteristic of green based on GaN micro-LED arrays von Tian, Wenya, Wu, Yongshuan, Wu, Tianxiang, Dou, Long, Xiao, Jinqing, Li, Junhui

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Characterization of a Probe Test System With Micro-Magnetorheological Flexible Loading von Liu, Yixin, Xiao, Jinqing, Li, Junhui

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Effects of test levels on creep and relaxation characteristic parameters of stem for rice seedlings grown in plastic cell tray von Xiao, Jinqing, Ma, Ruijun, Chen, Yu

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A single-vision dual imaging optical system in flip chip alignment von Wu, Tianxiang, Wu, Yongshuan, Tian, Wenya, Dou, Long, Xiao, Jinqing, Li, Junhui

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Application of InP Quantum Dot film by Photolithography Technology on a Micro-LED Display von Tian, Wenya, Wu, Tianxiang, Wu, Yongshuan, Xiao, Jinqing, Wang, Pengkai, Li, Junhui

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Process parameters and modelling study of thermosonic flip chip bonding von Wu, Yongshuan, Wang, Pengkai, Wu, Tianxiang, Xiao, Jinqing, Dou, Long, Liu, Zhan, Li, Junhui

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Response Surface Analysis of Process Parameters for Thermocompression Ultrasonic Flip Bonding of Chips von Wang, Pengkai, Wu, Yongshuan, Wu, Tianxiang, Xiao, Jinqing, Zhu, Yusheng, Liu, Zhan, Li, Junhui

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Design and Fabrication of Leadless Package Structure for Pressure Sensors von Tian, Junwang, Jin, Zhong, Tang, Xin, Peng, Wenxian, Liu, Junfu, Liu, Yunpeng, Chen, Taotao, Xiao, Jinqing, Li, Junhui

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Ultrasonic-Assisted Micro-Silver Paste Sintering for Flip-Chip Bonding von Lu, Peiyuan, Wu, Yongshuan, Wu, Tianxiang, Tian, Wenya, Dou, Long, Xiao, Jinqing, Li, Junhui

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Research on Flip-Chip Bonding Process and Thermal Cycle Reliability Simulation of 3-D Stacked Structure von Chen, Mingming, Zhang, Yuexin, Guo, Yuhua, Wu, Tianxiang, Dou, Long, Tian, Wenya, Xiao, Jinqing, Li, Junhui

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Electromechanical Performance of Microprobe Test With Cuboid Magnetorheological Damper in Microelectronic Packaging von Wu, Tianxiang, Tian, Wenya, Dou, Long, Jin, Zhong, Liu, Junfu, Liu, Yunpeng, Chen, Taotao, Xiao, Jinqing, Li, Junhui

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High-G Shock Reliability of 3-D Integrated Structure Microsystem Based on Finite Element Simulation von Long, Yangtao, Di, Ziye, Lu, Chenhao, Tian, Wenya, Dou, Long, Jin, Zhong, Xiao, Jinqing, Li, Junhui

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Soil scouring test system von GUO YUAN, XIAO JINQING

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